Investigation of the tribological behavior of 2D sinusoidal texture CoNiCrFeMn high-entropy alloy coating on Ni substrate

IF 4.3 3区 材料科学 Q2 MATERIALS SCIENCE, MULTIDISCIPLINARY
Youhua Li, Qianli Ma, Xuetao Qiao, Xiaolong Yin, Hechun Yu, Wenbo Wang, Guoqing Zhang
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引用次数: 0

Abstract

Two-dimensional (2D) sinusoidal texture was applied to CoNiCrFeMn high entropy alloy (HEA) coating. The tribological behavior of HEA/Ni workpieces under different conditions was studied by molecular dynamics (MD) simulation. The friction behavior and influence mechanism of non-textured and textured workpieces under different conditions were compared. The results show that when the periodic parameter of the texture T = 30, the subsurface damage depth of the workpiece decreases, the internal dislocation strengthening decreases, resulting in the tangential force and normal force decrease, and the friction coefficient decreases. At the friction depths of 15 Å, 20 Å, and 25 Å, the number of worn atoms decreases by 85.3 %, 73.4 %, and 65.85 %, respectively. In addition, the presence of texture improves the local temperature rise and shear strain accumulation caused by higher scratch velocity, resulting in uniform stress distribution during friction and improved wear resistance of the workpiece.
Ni基体上二维正弦织构CoNiCrFeMn高熵合金涂层摩擦学行为研究
将二维(2D)正弦织构应用于CoNiCrFeMn高熵合金(HEA)涂层。采用分子动力学(MD)模拟方法研究了不同条件下HEA/Ni工件的摩擦学行为。比较了不同条件下非织构和织构工件的摩擦行为及其影响机理。结果表明:当织构周期参数T = 30时,工件亚表面损伤深度减小,内部位错强化减小,导致切向力和法向力减小,摩擦系数减小;在摩擦深度为15 Å、20 Å和25 Å时,磨损原子数分别减少了85.3%、73.4%和65.85%。织构的存在改善了高划痕速度引起的局部温升和剪切应变积累,使摩擦过程中的应力分布均匀,提高了工件的耐磨性。
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来源期刊
Materials Chemistry and Physics
Materials Chemistry and Physics 工程技术-材料科学:综合
CiteScore
8.70
自引率
4.30%
发文量
1515
审稿时长
69 days
期刊介绍: Materials Chemistry and Physics is devoted to short communications, full-length research papers and feature articles on interrelationships among structure, properties, processing and performance of materials. The Editors welcome manuscripts on thin films, surface and interface science, materials degradation and reliability, metallurgy, semiconductors and optoelectronic materials, fine ceramics, magnetics, superconductors, specialty polymers, nano-materials and composite materials.
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