Influence Mechanism of Vacancy Defects Effect on the Intrinsic Electronic Properties of h-BN and the Thermodynamic and Dielectric Properties of h-BN/PI Interface

IF 2.9 3区 化学 Q3 CHEMISTRY, PHYSICAL
Lujia Wang, Guangliang Liu, Wenyu Ye, Jianwen Zhang, Dingyu Bao
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引用次数: 0

Abstract

Polyimide (PI), known for its excellent properties, has been widely applied across various fields. However, its thermodynamic and dielectric properties require further enhancement. Hexagonal boron nitride (h-BN) is commonly employed as a nano-modifier to enhance the properties of the PI matrix. However, the vacancy defects in h-BN limit the improvement of the composite's properties. In this study, molecular simulation techniques are utilised to investigate the effects of vacancy defects on the electronic properties of h-BN and the interfacial properties of h-BN/PI composites. The simulation results indicate that as the number of vacancy defects increases, the distortion of the h-BN geometric structure becomes more severe. Among the single-atom vacancy defects, N-atom vacancies exert a more significant impact on the geometrical structure and insulating properties of h-BN. Two defect levels are introduced into the energy band structure of the diatomic vacancy defect model, thereby weakening the insulating performance of h-BN. The band structure of the three-atom vacancy defect model undergoes greater changes, with additional defect levels introduced into the band gap, resulting in reduced insulating performance and a semi-metallic state in h-BN. As the number of vacancy defects increases, the thermal conductivity and mechanical properties of the h-BN/PI interface deteriorate. In contrast, B-atom vacancies have a more pronounced effect on interfacial heat transfer, whereas N-atom vacancies more significantly affect mechanical properties. The free volume fraction of the model increases as the vacancy defect rate rises, leading to an increase in the relative dielectric constant of the h-BN/PI interface. This paper comprehensively examines the effects of vacancy defects on the interfacial properties of h-BN/PI composites, providing a foundation for the application of h-BN as a filler in the functional modification of PI.
空位缺陷对h-BN本征电子性能及h-BN/PI界面热力学和介电性能的影响机理
聚酰亚胺(PI)以其优异的性能被广泛应用于各个领域。但其热力学和介电性能有待进一步提高。六方氮化硼(h-BN)是一种常用的纳米改性剂,可以增强PI基体的性能。然而,h-BN中的空位缺陷限制了复合材料性能的提高。在本研究中,利用分子模拟技术研究了空位缺陷对h-BN电子性能和h-BN/PI复合材料界面性能的影响。仿真结果表明,随着空位缺陷数量的增加,h-BN几何结构的畸变越来越严重。在单原子空位缺陷中,n原子空位对h-BN的几何结构和绝缘性能的影响更为显著。在双原子空位缺陷模型的能带结构中引入了两个缺陷能级,从而削弱了h-BN的绝缘性能。三原子空位缺陷模型的能带结构发生了更大的变化,在带隙中引入了额外的缺陷水平,导致h-BN的绝缘性能降低和半金属态。随着空位缺陷数量的增加,h-BN/PI界面的热导率和力学性能下降。相比之下,b原子空位对界面传热的影响更为显著,而n原子空位对力学性能的影响更为显著。模型的自由体积分数随着空位缺陷率的增加而增加,导致h-BN/PI界面的相对介电常数增加。本文全面考察了空位缺陷对h-BN/PI复合材料界面性能的影响,为h-BN作为填料在PI功能改性中的应用提供了基础。
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来源期刊
Physical Chemistry Chemical Physics
Physical Chemistry Chemical Physics 化学-物理:原子、分子和化学物理
CiteScore
5.50
自引率
9.10%
发文量
2675
审稿时长
2.0 months
期刊介绍: Physical Chemistry Chemical Physics (PCCP) is an international journal co-owned by 19 physical chemistry and physics societies from around the world. This journal publishes original, cutting-edge research in physical chemistry, chemical physics and biophysical chemistry. To be suitable for publication in PCCP, articles must include significant innovation and/or insight into physical chemistry; this is the most important criterion that reviewers and Editors will judge against when evaluating submissions. The journal has a broad scope and welcomes contributions spanning experiment, theory, computation and data science. Topical coverage includes spectroscopy, dynamics, kinetics, statistical mechanics, thermodynamics, electrochemistry, catalysis, surface science, quantum mechanics, quantum computing and machine learning. Interdisciplinary research areas such as polymers and soft matter, materials, nanoscience, energy, surfaces/interfaces, and biophysical chemistry are welcomed if they demonstrate significant innovation and/or insight into physical chemistry. Joined experimental/theoretical studies are particularly appreciated when complementary and based on up-to-date approaches.
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