A 2.4 GHz Wireless Temperature Sensor with 0.93 C precision designed in 130 nm CMOS technology for Internet of Things applications

IF 1.3 4区 工程技术 Q3 COMPUTER SCIENCE, INFORMATION SYSTEMS
Hugo Dias Gilo;Francisco de Assis Brito Filho
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引用次数: 0

Abstract

Temperature sensors are present in many applications within the context of the Internet of Things, such as monitoring people, equipment, homes, industries, among others. Some of these portable devices need low power consumption, be compact, and have a linearity range for their application. There- fore, this work proposes a wireless temperature sensor developed in 130-nanometer CMOS technology, designed to operate in the 2.4 GHz ISM band. The wireless sensor was developed using exclusively open-source EDA tools and the Skywater 130 nm openPDK. The devices linearity as evaluated between -50C to 200C, demonstrating a maximum inaccuracy of 0.93 C in a range from 12.0 C to 144.0 C, while consuming only 1.6 mW and occupying an area of 0.028 mm, including the RF block. Additionally, this work was compared with sensors reported in the state of the art and its area and maximum error were smaller.
采用130纳米CMOS技术设计的2.4 GHz无线温度传感器,精度为0.93℃,适用于物联网应用
在物联网的背景下,温度传感器存在于许多应用中,例如监控人员,设备,家庭,工业等。这些便携式设备中的一些需要低功耗,紧凑,并有一个线性范围的应用。因此,本研究提出了一种采用130纳米CMOS技术开发的无线温度传感器,设计用于2.4 GHz ISM频段。无线传感器是使用完全开源的EDA工具和Skywater 130纳米openPDK开发的。器件的线性度在-50℃至200℃之间进行评估,在12.0℃至144.0℃的范围内显示出0.93℃的最大误差,而功耗仅为1.6 mW,占用0.028 mm的面积,包括射频块。此外,将该工作与目前最先进的传感器进行比较,其面积和最大误差更小。
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来源期刊
IEEE Latin America Transactions
IEEE Latin America Transactions COMPUTER SCIENCE, INFORMATION SYSTEMS-ENGINEERING, ELECTRICAL & ELECTRONIC
CiteScore
3.50
自引率
7.70%
发文量
192
审稿时长
3-8 weeks
期刊介绍: IEEE Latin America Transactions (IEEE LATAM) is an interdisciplinary journal focused on the dissemination of original and quality research papers / review articles in Spanish and Portuguese of emerging topics in three main areas: Computing, Electric Energy and Electronics. Some of the sub-areas of the journal are, but not limited to: Automatic control, communications, instrumentation, artificial intelligence, power and industrial electronics, fault diagnosis and detection, transportation electrification, internet of things, electrical machines, circuits and systems, biomedicine and biomedical / haptic applications, secure communications, robotics, sensors and actuators, computer networks, smart grids, among others.
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