Crack in presence of holes: Experimental measurements and configurational force analysis

IF 5 2区工程技术 Q1 ENGINEERING, MECHANICAL

Theoretical and Applied Fracture Mechanics Pub Date : 2025-04-15 DOI:10.1016/j.tafmec.2025.104951

Rohit Upadhyaya , Saurav Sunil , R.N. Singh , Abhishek Tiwari

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引用次数: 0

Abstract

The presence of holes significantly influences crack growth in elastic–plastic materials under monotonic loading. This study investigates the effect of holes on crack propagation in SS304 by evaluating the

J

-integral. A modified approach is developed to derive a geometry-dependent

f (a / W)

function for

J_{elastic}

, while revised factors

η

and

γ

improve the accuracy of

J_{plastic}

for nonstandard geometries. Finite element simulations using configurational forces provide additional insights into the crack driving force. This study enhances predictive capabilities for crack growth behavior in engineering applications.

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来源期刊

Theoretical and Applied Fracture Mechanics 工程技术-工程：机械

CiteScore

8.40

自引率

18.90%

发文量

435

审稿时长

37 days

期刊介绍： Theoretical and Applied Fracture Mechanics'' aims & scopes have been re-designed to cover both the theoretical, applied, and numerical aspects associated with those cracking related phenomena taking place, at a micro-, meso-, and macroscopic level, in materials/components/structures of any kind. The journal aims to cover the cracking/mechanical behaviour of materials/components/structures in those situations involving both time-independent and time-dependent system of external forces/moments (such as, for instance, quasi-static, impulsive, impact, blasting, creep, contact, and fatigue loading). Since, under the above circumstances, the mechanical behaviour of cracked materials/components/structures is also affected by the environmental conditions, the journal would consider also those theoretical/experimental research works investigating the effect of external variables such as, for instance, the effect of corrosive environments as well as of high/low-temperature.