Low insertion loss RF MEMS switches fabricated on glass substrates of G2.5 size using TFT display compatible process

IF 6.1 1区工程技术 Q1 ENGINEERING, MANUFACTURING

Journal of Manufacturing Processes Pub Date : 2025-04-19 DOI:10.1016/j.jmapro.2025.04.007

Chao Zhou , Lixing Liu , Yurong He, Miaoqin Chen, Xudong Gao, Feng Jiang, Yanzhao Li

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引用次数: 0

Abstract

This work demonstrated the first fabrication of resistive RF MEMS switches on G2.5 glass substrates via thin-film transistor (TFT) display compatible processes. By replacing gold with a copper cantilever architecture, we achieved low insertion loss (

<

0.55 dB from DC to 6 GHz) while resolving the inherent trade-off between actuation voltage and switching speed. The optimized design attained a response time of

17 μ s

at 22 V driving voltage, with isolation exceeding 28 dB. The display process-compatible planarization and sacrificial layer techniques eliminated conventional Micro-Electro-Mechanical System (MEMS) processing while maintaining insertion loss below 0.55 dB. The successful convergence of copper-based MEMS functionality with display industry infrastructure established a transformative platform for cost-sensitive 5G applications, where traditional silicon-based approaches faced limitations in scalability and integration density.

Abstract Image

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使用 TFT 显示屏兼容工艺在 G2.5 尺寸玻璃基板上制造低插入损耗射频 MEMS 开关

这项工作首次展示了通过薄膜晶体管（TFT）显示兼容工艺在G2.5玻璃基板上制造电阻式RF MEMS开关。通过用铜悬臂结构取代金，我们实现了低插入损耗（从DC到6 GHz），同时解决了驱动电压和开关速度之间的固有权衡。优化设计在22v驱动电压下的响应时间为17μs，隔离度超过28 dB。显示工艺兼容的平面化和牺牲层技术消除了传统的微机电系统（MEMS）工艺，同时将插入损耗保持在0.55 dB以下。铜基MEMS功能与显示行业基础设施的成功融合为成本敏感的5G应用建立了一个变革性平台，传统的硅基方法在可扩展性和集成密度方面受到限制。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

Journal of Manufacturing Processes ENGINEERING, MANUFACTURING-

CiteScore

10.20

自引率

11.30%

发文量

833

审稿时长

50 days

期刊介绍： The aim of the Journal of Manufacturing Processes (JMP) is to exchange current and future directions of manufacturing processes research, development and implementation, and to publish archival scholarly literature with a view to advancing state-of-the-art manufacturing processes and encouraging innovation for developing new and efficient processes. The journal will also publish from other research communities for rapid communication of innovative new concepts. Special-topic issues on emerging technologies and invited papers will also be published.