Material removal and defect evolution in nano-cutting of γ-TiAl alloy: The effect of twin boundary

IF 6.1 1区 工程技术 Q1 ENGINEERING, MANUFACTURING
Huiming Wang , Haiyan Li , Hui Cao , Zhaoting Guo , Zehai Ren , Wenke Chen , Ruicheng Feng , Tao Chen
{"title":"Material removal and defect evolution in nano-cutting of γ-TiAl alloy: The effect of twin boundary","authors":"Huiming Wang ,&nbsp;Haiyan Li ,&nbsp;Hui Cao ,&nbsp;Zhaoting Guo ,&nbsp;Zehai Ren ,&nbsp;Wenke Chen ,&nbsp;Ruicheng Feng ,&nbsp;Tao Chen","doi":"10.1016/j.jmapro.2025.04.043","DOIUrl":null,"url":null,"abstract":"<div><div>Nano-twinned materials have attracted considerable attention due to their unique plastic deformation mechanisms and the formation of prismatic dislocation loops (PDLs). However, the impact of twins on nano-cutting behavior remains inadequately understood. This paper conducts molecular dynamics simulations to investigate the material removal behavior and the evolution of PDLs in twin single-crystal γ-TiAl alloy during nano-cutting. The results show that during the cutting process of twinned TiAl alloys, PDLs are generated through multiple dislocation reactions and cross-slips, and there are two types of chips, namely regular and serrated, as well as two dislocation reaction paths, namely slip along the twin boundary and break through the twin boundary. When the cutting direction is <span><math><mfenced><mrow><mover><mn>1</mn><mo>¯</mo></mover><mover><mn>1</mn><mo>¯</mo></mover><mn>2</mn></mrow></mfenced></math></span>[111], a significant number of atoms migrate into the matrix interior, the material undergoes extrusion removal, forming regular chips and generating a large number of PDLs. When the PDLs slip to the twin boundary, they are completely blocked and slip along the twin boundary, resulting in detwinning. However, when the cutting direction is <span><math><mfenced><mrow><mover><mn>1</mn><mo>¯</mo></mover><mover><mn>1</mn><mo>¯</mo></mover><mn>2</mn></mrow></mfenced><mfenced><mrow><mover><mn>1</mn><mo>¯</mo></mover><mover><mn>1</mn><mo>¯</mo></mover><mover><mn>1</mn><mo>¯</mo></mover></mrow></mfenced></math></span>, a large number of atoms flow upward to form chips, the material undergoes shear removal, forming serrated chips and forming incomplete PDLs. When the incomplete dislocation loops reach the twin boundary, cross-slip occurs and successfully penetrates the twin boundary. This research not only enhances the understanding of the deformation mechanisms of twin single-crystal γ-TiAl alloy during nano-cutting, but also provides new insights into the interaction between dislocation loops and twin boundaries.</div></div>","PeriodicalId":16148,"journal":{"name":"Journal of Manufacturing Processes","volume":"144 ","pages":"Pages 78-92"},"PeriodicalIF":6.1000,"publicationDate":"2025-04-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Manufacturing Processes","FirstCategoryId":"5","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S1526612525004360","RegionNum":1,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"ENGINEERING, MANUFACTURING","Score":null,"Total":0}
引用次数: 0

Abstract

Nano-twinned materials have attracted considerable attention due to their unique plastic deformation mechanisms and the formation of prismatic dislocation loops (PDLs). However, the impact of twins on nano-cutting behavior remains inadequately understood. This paper conducts molecular dynamics simulations to investigate the material removal behavior and the evolution of PDLs in twin single-crystal γ-TiAl alloy during nano-cutting. The results show that during the cutting process of twinned TiAl alloys, PDLs are generated through multiple dislocation reactions and cross-slips, and there are two types of chips, namely regular and serrated, as well as two dislocation reaction paths, namely slip along the twin boundary and break through the twin boundary. When the cutting direction is 1¯1¯2[111], a significant number of atoms migrate into the matrix interior, the material undergoes extrusion removal, forming regular chips and generating a large number of PDLs. When the PDLs slip to the twin boundary, they are completely blocked and slip along the twin boundary, resulting in detwinning. However, when the cutting direction is 1¯1¯21¯1¯1¯, a large number of atoms flow upward to form chips, the material undergoes shear removal, forming serrated chips and forming incomplete PDLs. When the incomplete dislocation loops reach the twin boundary, cross-slip occurs and successfully penetrates the twin boundary. This research not only enhances the understanding of the deformation mechanisms of twin single-crystal γ-TiAl alloy during nano-cutting, but also provides new insights into the interaction between dislocation loops and twin boundaries.

Abstract Image

γ-TiAl合金纳米切削过程中材料去除与缺陷演化:孪晶界的影响
纳米孪晶材料由于其独特的塑性变形机制和棱柱位错环的形成引起了人们的广泛关注。然而,孪晶对纳米切削行为的影响尚不清楚。本文通过分子动力学模拟研究了双单晶γ-TiAl合金在纳米切削过程中的材料去除行为和pdl的演变。结果表明:在孪晶TiAl合金切削过程中,通过多次位错反应和交叉滑移产生pdl,切屑有规则型和锯齿型两种类型,以及沿孪晶边界滑移和突破孪晶边界两种位错反应路径。当切削方向为1¯1¯2[111]时,大量原子迁移到基体内部,材料发生挤压去除,形成规则切屑,产生大量pdl。当pdl滑移到孪晶边界时,它们被完全阻挡并沿着孪晶边界滑移,导致失孪。但当切削方向为1¯1¯21¯1¯1¯1¯时,大量原子向上流动形成切屑,材料发生剪切去除,形成锯齿状切屑,形成不完整的pdl。当不完全位错环到达孪晶界时,发生交叉滑移并成功穿透孪晶界。本研究不仅提高了对孪晶γ-TiAl合金在纳米切削过程中变形机理的认识,而且为位错环与孪晶界之间的相互作用提供了新的认识。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 求助全文
来源期刊
Journal of Manufacturing Processes
Journal of Manufacturing Processes ENGINEERING, MANUFACTURING-
CiteScore
10.20
自引率
11.30%
发文量
833
审稿时长
50 days
期刊介绍: The aim of the Journal of Manufacturing Processes (JMP) is to exchange current and future directions of manufacturing processes research, development and implementation, and to publish archival scholarly literature with a view to advancing state-of-the-art manufacturing processes and encouraging innovation for developing new and efficient processes. The journal will also publish from other research communities for rapid communication of innovative new concepts. Special-topic issues on emerging technologies and invited papers will also be published.
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术官方微信