Study of machining damage in single abrasive grain cutting alumina ceramics by DEM simulation

Abstract

Grinding results affect the quality of the final product. A single abrasive grain cutting test is an important method to study the complex grinding process. In this study, the discrete element method (DEM) is used to simulate diamond single abrasive grain cutting alumina ceramics to study the damage mechanism of the grinding process, analyze the effects of process parameters and single abrasive grain parameters on the machining damage, cutting force and residual stress, and make a comparative analysis with the single abrasive grain cutting test. Results indicate that the cutting depth and abrasive angle have obvious effects on machining damage, cutting force, and residual stress, while the cutting speed and abrasive grain size have smaller effects. The cutting effect of regular quadrilateral pyramid abrasive grains and regular octahedral abrasive grains is better, the effect on the cutting process is smaller, and the machining damage, cutting force, and residual stress are smaller. The simulation matches the test results, which verifies the reasonableness of the discrete element simulation of single abrasive grain cutting.