Subtle Defect Detection Network: More accurately detect subtle defects on the Printed Circuit Board surface

IF 8 2区 计算机科学 Q1 AUTOMATION & CONTROL SYSTEMS
Liying Zhu, Sen Wang, Mingfang Chen, Yang Zhu, Kaizhe Xing, Aiping Shen
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引用次数: 0

Abstract

Printed circuit boards (PCBs) are the hardware foundation of large-scale integrated circuits, where surface quality inspection plays a critical role in manufacturing reliability. We proposed a subtle defect detection network (SDD-Net) to solve the detection problems in PCB surface defects, such as complex background, difficulty in distinguishing between foreground and background, random defect shape, area, and position. We propose a lightweight receptive field augmentation network (LRFA-Net) as the backbone effectively augments the receptive field, reduces parameters, and enhances feature extraction capabilities. A more lightweight multi-scale feature and coordinate information interaction mechanism was designed to enhance the capacity of the network to discern small targets in complex backgrounds. The combination of Varifocal Loss and Complete Intersection over Union Loss (CIoU) addresses the issue of distinguishing between the foreground and background, as well as adapting to PCB surface defects with variable shapes and positions. A lightweight Omni-dimensional dynamic convolutional prediction head (OD-Head) is designed to introduce multi-dimensional attention to effectively perceive small defects on the PCB surface. Compared with other algorithms, SDD-Net has a mean average precision (mAP0.5) of 99.6 % on the PCB Defect Augmented dataset, and the detection speed reaches 53 frames per second, which achieves a balance between accuracy and speed, and the effect is better than other algorithms. At the same time, SDD-Net is also experimentally verified on the real PCB surface welding defect data set, and the results show that SDD-Net also has the best detection effect.
细微缺陷检测网络:更准确地检测印刷电路板表面的细微缺陷
印刷电路板(pcb)是大规模集成电路的硬件基础,其表面质量检测对制造可靠性起着至关重要的作用。针对PCB表面缺陷背景复杂、前景和背景难以区分、缺陷形状、面积和位置随机等问题,提出了一种细微缺陷检测网络(SDD-Net)。我们提出了一个轻量级的感受野增强网络(LRFA-Net)作为主干,有效地增强了感受野,减少了参数,增强了特征提取能力。设计了一种更轻量化的多尺度特征和坐标信息交互机制,增强了网络对复杂背景下小目标的识别能力。变焦损耗和完全交会损耗(CIoU)的结合解决了区分前景和背景的问题,以及适应具有可变形状和位置的PCB表面缺陷。设计了一种轻量级的全维动态卷积预测头(OD-Head),引入多维关注,有效地感知PCB表面的小缺陷。与其他算法相比,SDD-Net在PCB缺陷增强数据集上的平均精度(mAP0.5)达到99.6%,检测速度达到53帧/秒,实现了精度和速度的平衡,效果优于其他算法。同时,在实际的PCB表面焊接缺陷数据集上对SDD-Net进行了实验验证,结果表明SDD-Net也具有最佳的检测效果。
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来源期刊
Engineering Applications of Artificial Intelligence
Engineering Applications of Artificial Intelligence 工程技术-工程:电子与电气
CiteScore
9.60
自引率
10.00%
发文量
505
审稿时长
68 days
期刊介绍: Artificial Intelligence (AI) is pivotal in driving the fourth industrial revolution, witnessing remarkable advancements across various machine learning methodologies. AI techniques have become indispensable tools for practicing engineers, enabling them to tackle previously insurmountable challenges. Engineering Applications of Artificial Intelligence serves as a global platform for the swift dissemination of research elucidating the practical application of AI methods across all engineering disciplines. Submitted papers are expected to present novel aspects of AI utilized in real-world engineering applications, validated using publicly available datasets to ensure the replicability of research outcomes. Join us in exploring the transformative potential of AI in engineering.
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