{"title":"Determinants of Adopting 3D Technology Integrated With Artificial Intelligence in STEM Higher Education: A UTAUT2 Model Approach","authors":"Vi Loi Truong, Lenh Phan Cong Pham","doi":"10.1002/cae.70019","DOIUrl":null,"url":null,"abstract":"<div>\n \n <p>Incorporating 3D technology and artificial intelligence, often known as AI, into STEM education in the current day is creating new opportunities to improve student engagement and performance. With an emphasis on STEM areas specifically, this study attempts to bring the elements that affect the uptake of AI-enabled 3D instructional technology. A survey was carried out with 300 participants, including teachers and students from universities. To gauge participant impressions, the study used UTAUT2—the Unified Theory of Acceptance and Use of Technology 2 framework. IMB SPSS 25 and AMOS 24 has been used to calculate, evaluate, analyze data to determine the main variables influencing the adoption of these technologies. The results show that while AI and 3D technologies have a great deal of potential to enhance users' interaction, understanding, and engagement with difficult scientific concepts, there are still obstacles to overcome, including those related to infrastructure, cost, and the requirement for faculty training. Furthermore, it was discovered that moderating factors including experience, gender, age, and education level had very little effect on the final outcomes. This study provides insightful information on how to successfully incorporate 3D and AI technology into STEM curricula at the university level.</p>\n </div>","PeriodicalId":50643,"journal":{"name":"Computer Applications in Engineering Education","volume":"33 3","pages":""},"PeriodicalIF":2.0000,"publicationDate":"2025-04-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Computer Applications in Engineering Education","FirstCategoryId":"5","ListUrlMain":"https://onlinelibrary.wiley.com/doi/10.1002/cae.70019","RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"COMPUTER SCIENCE, INTERDISCIPLINARY APPLICATIONS","Score":null,"Total":0}
引用次数: 0
Abstract
Incorporating 3D technology and artificial intelligence, often known as AI, into STEM education in the current day is creating new opportunities to improve student engagement and performance. With an emphasis on STEM areas specifically, this study attempts to bring the elements that affect the uptake of AI-enabled 3D instructional technology. A survey was carried out with 300 participants, including teachers and students from universities. To gauge participant impressions, the study used UTAUT2—the Unified Theory of Acceptance and Use of Technology 2 framework. IMB SPSS 25 and AMOS 24 has been used to calculate, evaluate, analyze data to determine the main variables influencing the adoption of these technologies. The results show that while AI and 3D technologies have a great deal of potential to enhance users' interaction, understanding, and engagement with difficult scientific concepts, there are still obstacles to overcome, including those related to infrastructure, cost, and the requirement for faculty training. Furthermore, it was discovered that moderating factors including experience, gender, age, and education level had very little effect on the final outcomes. This study provides insightful information on how to successfully incorporate 3D and AI technology into STEM curricula at the university level.
期刊介绍:
Computer Applications in Engineering Education provides a forum for publishing peer-reviewed timely information on the innovative uses of computers, Internet, and software tools in engineering education. Besides new courses and software tools, the CAE journal covers areas that support the integration of technology-based modules in the engineering curriculum and promotes discussion of the assessment and dissemination issues associated with these new implementation methods.