Wenbin Tu , Shanlin Wang , Weihua Chen , Pengfei Wang , Jilin Xie , Si Chen , Min Zheng , Mingwei Wei , Yuhua Chen , Fan Wu
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引用次数: 0
Abstract
The interfacial intermetallic compounds (IMC) layers evolution and shear properties in Sn-0.7Cu-0.8Zn/Cu and Sn-0.7Cu-0.8Zn–5Bi/Cu solder joint at different reflow soldering time were investigated. The results demonstrated that the IMC layers of solder joint with/without Bi doping and the increase of reflow soldering time are Cu6Sn5 phase. However, Bi addition will increase the γ-Cu5Zn8 phase closed to the IMC layer in solder matrix. The doping Bi can decrease the growth rate and voids of IMC layer. The decrease in IMC layer thickness is associated with the decline in the availability of Cu atoms and hindering the diffusion path for Cu atoms. In the case of short-time reflow soldering time, the grain size of the IMC layer in Bi-free solder joint is smaller compared to Bi-added solder joint. However, the grain size of the IMC layer of Bi-free solder joint is larger than that of Bi-added solder joint after long reflow soldering time. Although the shear strength of Bi-free and Bi-added solder joints decreases as reflow soldering time are prolonged, the shear strength of Bi-added solder joints is higher compared to Bi-free solder joints, which is the combined effect of solution strengthening, thickness reduction and grain refinement of IMC layer.
期刊介绍:
The Journal of Materials Research and Technology is a publication of ABM - Brazilian Metallurgical, Materials and Mining Association - and publishes four issues per year also with a free version online (www.jmrt.com.br). The journal provides an international medium for the publication of theoretical and experimental studies related to Metallurgy, Materials and Minerals research and technology. Appropriate submissions to the Journal of Materials Research and Technology should include scientific and/or engineering factors which affect processes and products in the Metallurgy, Materials and Mining areas.