{"title":"A new solution based on multi-objective algorithm for multi-application mappings for Many-Core systems","authors":"Manoel de Almeida;Emerson Pedrino;Igor Gallon","doi":"10.1109/TLA.2025.10930369","DOIUrl":null,"url":null,"abstract":"In the current context of intelligent systems and big data, specifically concerning high-performance and efficient data processing for streams applications, single-core systems can no longer meet this demand. Increasing their operating frequencies would result in higher energy consumption for the chip as a whole. Thus, in this scenario, multicore and manycore chips appear to be a viable solution. However, distributing mono8 application or multi-application tasks on these devices is not trivial in practice. It is necessary to consider heat dissipation effects throughout the system while simultaneously ensuring fault tolerance and good load balancing. Although there is not yet a considerable number of works in the literature addressing the allocation of multi-applications in NoCs, there are many works focusing on mapping mono-applications. Therefore, this article proposes a multi-objective mapping model that focuses on performance metrics and heat distribution for multi-applications in manycores with NoCs, aiming to contribute in this direction. The results found are compared with the state-of-the-art algorithm in this scenario, showing promise for the field, with improvements of more than 30% in latency and 38% in fault tolerance when all applications are taken into account.","PeriodicalId":55024,"journal":{"name":"IEEE Latin America Transactions","volume":"23 4","pages":"323-328"},"PeriodicalIF":1.3000,"publicationDate":"2025-03-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10930369","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Latin America Transactions","FirstCategoryId":"5","ListUrlMain":"https://ieeexplore.ieee.org/document/10930369/","RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"COMPUTER SCIENCE, INFORMATION SYSTEMS","Score":null,"Total":0}
引用次数: 0
Abstract
In the current context of intelligent systems and big data, specifically concerning high-performance and efficient data processing for streams applications, single-core systems can no longer meet this demand. Increasing their operating frequencies would result in higher energy consumption for the chip as a whole. Thus, in this scenario, multicore and manycore chips appear to be a viable solution. However, distributing mono8 application or multi-application tasks on these devices is not trivial in practice. It is necessary to consider heat dissipation effects throughout the system while simultaneously ensuring fault tolerance and good load balancing. Although there is not yet a considerable number of works in the literature addressing the allocation of multi-applications in NoCs, there are many works focusing on mapping mono-applications. Therefore, this article proposes a multi-objective mapping model that focuses on performance metrics and heat distribution for multi-applications in manycores with NoCs, aiming to contribute in this direction. The results found are compared with the state-of-the-art algorithm in this scenario, showing promise for the field, with improvements of more than 30% in latency and 38% in fault tolerance when all applications are taken into account.
期刊介绍:
IEEE Latin America Transactions (IEEE LATAM) is an interdisciplinary journal focused on the dissemination of original and quality research papers / review articles in Spanish and Portuguese of emerging topics in three main areas: Computing, Electric Energy and Electronics. Some of the sub-areas of the journal are, but not limited to: Automatic control, communications, instrumentation, artificial intelligence, power and industrial electronics, fault diagnosis and detection, transportation electrification, internet of things, electrical machines, circuits and systems, biomedicine and biomedical / haptic applications, secure communications, robotics, sensors and actuators, computer networks, smart grids, among others.