Preparation and performance study of novel Cu / TiBN electronic paste

Abstract

TiBN powder was synthesized using a boronizing sintering method, resulting in a core-shell structure with a soft shell and hard core. This structure exhibits stable electrical conductivity and excellent oxidation resistance. Utilizing this powder, a novel Cu/TiBN electronic paste was prepared. The impact of TiBN content on the resistivity, oxidation resistance, and hardness of the copper-based conductive film was investigated using X-ray diffraction (XRD), scanning electron microscopy (SEM), four-point probe measurements, nanoindentation, and oxidation weight gain methods. The results indicate that with a TiBN nano powder content of 0.75 wt%, the resistivity is 1.025 $\times$ 10⁻⁷ Ω m, which is higher than that of pure copper. However, at this concentration, the oxidation resistance, hardness, and elastic modulus of the copper-based conductive film are significantly enhanced. Compared to pure copper, the weight gain due to oxidation decreases by approximately 22 %, while the hardness and elastic modulus increase by about 48 % and 60 %, respectively. The synthesis of TiBN powder provides a novel material choice for the preparation of high-performance copper-based electronic pastes.