Bulletin Board: IEEE CEIDP 2025 Updates

IF 2.6 4区工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC

IEEE Electrical Insulation Magazine Pub Date : 2025-03-12 DOI:10.1109/MEI.2025.10924650

引用次数: 0

Abstract

The 100th International Conference on Electrical Insulation and Dielectric Phenomena (CEIDP) is taking place in Manchester, United Kingdom, from September 14 to 17, 2025. The CEIDP was established within the Division of Engineering and Industrial Research, National Academy of Sciences—National Research Council in 1920 in nearby Manhattan, New York, and continues to provide opportunity for specialists from around the world to meet and exchange their expertise, annually, now under sponsorship from the IEEE Dielectrics and Electrical Insulation Society. The goal of this annual conference is to bring together researchers in all disciplines from industry, universities, government, and other laboratories to discuss the latest results and developments in the area of electrical insulation and dielectric phenomena. The CEIDP is aimed at fostering free discussion of scientific and technical topics, but conference participants are expected to avoid any commercialization of their research activities or research results.

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来源期刊

IEEE Electrical Insulation Magazine 工程技术-工程：电子与电气

CiteScore

4.60

自引率

3.40%

发文量

121

审稿时长

>12 weeks

期刊介绍： The EI Magazine publishes articles written by authors from industry, research institutes and academia. The articles are more practical in content than the papers published in the Transactions. Usually three articles are published in each issue. The articles deal with dielectric materials, processes and new developments applied to industry products. Also the EI Magazine is used to promote upcoming conferences and solicits papers for the conferences. In addition, reports on past conferences are given in many issues. Book reviews and news items are included. An editorial is written by both the EIC and the President of DEIS in alternate issues. Advertising of insulation products appears in many issues.