Temperature-sensitivity points selection for positioning error modeling of CNC machine tools based on analytic hierarchy process

IF 6.1 1区 工程技术 Q1 ENGINEERING, MANUFACTURING
Yang Li , Jiaqi Wang , Yue Yang , Xu Zhao , Hexuan Shi , Fusheng Liang
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Abstract

Selecting the appropriate temperature-sensitivity points (TSPS) is the key to robustly predict the thermal error, which is an important part of the thermal error data-driven model (DDM). At present, grouping search is a comprehensive and scientific method to select the TSPS. However, the temperature measurement points with relatively low correlation to thermal error will be selected as the TSPS by this method, which can affect the performance and the stability of the error model's long-term prediction. Therefore, analytic hierarchy process (AHP) is introduced to alleviate this problem. In this paper, AHP is firstly applied to reassign the weights of the TSPS, and then the TSPS are reselected again according to the result. To prove the effectiveness of AHP, extreme learning machine with AHP (ELM-AHP) and other three classic models are taken as examples to construct the thermal error model. The results show that ELM-AHP model has high predictive accuracy and strong robustness. It is proved that AHP can solve the problem of TSPS with low correlation to a certain extent, which can reduce the number of TSPS, and simplify the error model.
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来源期刊
Journal of Manufacturing Processes
Journal of Manufacturing Processes ENGINEERING, MANUFACTURING-
CiteScore
10.20
自引率
11.30%
发文量
833
审稿时长
50 days
期刊介绍: The aim of the Journal of Manufacturing Processes (JMP) is to exchange current and future directions of manufacturing processes research, development and implementation, and to publish archival scholarly literature with a view to advancing state-of-the-art manufacturing processes and encouraging innovation for developing new and efficient processes. The journal will also publish from other research communities for rapid communication of innovative new concepts. Special-topic issues on emerging technologies and invited papers will also be published.
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