Study on ultrasonic transverse vibration assisted micro electrochemical machining of high aspect-ratio groove with controllable cross section

IF 6.1 1区工程技术 Q1 ENGINEERING, MANUFACTURING

Journal of Manufacturing Processes Pub Date : 2025-03-08 DOI:10.1016/j.jmapro.2025.03.020

Jianzhou Cai, Jing Li, Guixian Liu, Hongping Luo, Yongjun Zhang

{"title":"Study on ultrasonic transverse vibration assisted micro electrochemical machining of high aspect-ratio groove with controllable cross section","authors":"Jianzhou Cai, Jing Li, Guixian Liu, Hongping Luo, Yongjun Zhang","doi":"10.1016/j.jmapro.2025.03.020","DOIUrl":null,"url":null,"abstract":"<div><div>Micro-electrochemical machining (ECM) is an ideal machining method for micro-structure parts, but there is a problem that the electrolytic products cannot be discharged in time when machining micro-groove structures with high aspect ratio. In this paper, a novel ultrasonic transverse vibration assisted micro- electrochemical machining method (UTVA-ECM) is proposed, which combines Bernoulli-Euler beam theory and ultrasonic vibration technology. The transverse vibration of the micro-rode electrode can disperse electrolytic products effectively. However, under ultrasonic transverse vibration, the distribution of bubble layer on the micro-rode electrode is uneven, which affects the cross section of grooves in UTVA-ECM. In order to explore the influence of bubble layer distribution in UTVA-ECM. Firstly, in order to explore the influence of bubble layer distribution in UTVA-ECM, the theoretical model of transverse vibration of the micro-rode electrode was established. Through simulation and observation experiments, it is found that an uneven bubble layer affected by amplitude is formed on the electrode surface. The bubbles are dispersed in the wave loop area with strong amplitude, and the bubbles are difficult to disperse in the wave node area with weak amplitude. The uneven bubble layer leads to different conductivity at different positions in the axial direction of the electrode, and finally irregular cross section grooves are processed. Secondly, the influence of different processing parameters on groove machining by UTVA-ECM was studied. With the increase of ultrasonic voltage, the decrease of pulsed voltage and the increase of feed rate, the difference of groove width between wave node and wave loop area is greater. Finally, the machining of regular cross section grooves with an aspect ratio of 8.03 and the irregular cross section grooves with aspect ratio of 9.70 were realized by UTVA-ECM.</div></div>","PeriodicalId":16148,"journal":{"name":"Journal of Manufacturing Processes","volume":"141 ","pages":"Pages 613-626"},"PeriodicalIF":6.1000,"publicationDate":"2025-03-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Manufacturing Processes","FirstCategoryId":"5","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S1526612525002713","RegionNum":1,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"ENGINEERING, MANUFACTURING","Score":null,"Total":0}

引用次数: 0

Abstract

Micro-electrochemical machining (ECM) is an ideal machining method for micro-structure parts, but there is a problem that the electrolytic products cannot be discharged in time when machining micro-groove structures with high aspect ratio. In this paper, a novel ultrasonic transverse vibration assisted micro- electrochemical machining method (UTVA-ECM) is proposed, which combines Bernoulli-Euler beam theory and ultrasonic vibration technology. The transverse vibration of the micro-rode electrode can disperse electrolytic products effectively. However, under ultrasonic transverse vibration, the distribution of bubble layer on the micro-rode electrode is uneven, which affects the cross section of grooves in UTVA-ECM. In order to explore the influence of bubble layer distribution in UTVA-ECM. Firstly, in order to explore the influence of bubble layer distribution in UTVA-ECM, the theoretical model of transverse vibration of the micro-rode electrode was established. Through simulation and observation experiments, it is found that an uneven bubble layer affected by amplitude is formed on the electrode surface. The bubbles are dispersed in the wave loop area with strong amplitude, and the bubbles are difficult to disperse in the wave node area with weak amplitude. The uneven bubble layer leads to different conductivity at different positions in the axial direction of the electrode, and finally irregular cross section grooves are processed. Secondly, the influence of different processing parameters on groove machining by UTVA-ECM was studied. With the increase of ultrasonic voltage, the decrease of pulsed voltage and the increase of feed rate, the difference of groove width between wave node and wave loop area is greater. Finally, the machining of regular cross section grooves with an aspect ratio of 8.03 and the irregular cross section grooves with aspect ratio of 9.70 were realized by UTVA-ECM.

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来源期刊

Journal of Manufacturing Processes ENGINEERING, MANUFACTURING-

CiteScore

10.20

自引率

11.30%

发文量

833

审稿时长

50 days

期刊介绍： The aim of the Journal of Manufacturing Processes (JMP) is to exchange current and future directions of manufacturing processes research, development and implementation, and to publish archival scholarly literature with a view to advancing state-of-the-art manufacturing processes and encouraging innovation for developing new and efficient processes. The journal will also publish from other research communities for rapid communication of innovative new concepts. Special-topic issues on emerging technologies and invited papers will also be published.