Residual stress and distortion in arc-directed energy deposition: Formation mechanisms, analysis techniques, and mitigation strategies

IF 6.1 1区 工程技术 Q1 ENGINEERING, MANUFACTURING
Xuan Li, Zhiwei Zhao, Xinyu Cheng, Hui Chen, Jun Xiong
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引用次数: 0

Abstract

Arc-directed energy deposition (arc-DED) has gained attention as a promising technology for producing large-size metal components with high deposition rates and lower costs. However, the complex thermal processes involved in the deposition often lead to residual stress (RS) and distortion in deposited parts, which negatively impact the quality and performance of the final products. Therefore, controlling RS and distortion is essential for ensuring the high-quality production of arc-DED components. To mitigate RS and distortion in arc-DED, this paper presents a comprehensive review of the efforts made in previous research. The formation mechanisms of RS and distortion in arc-DED are analyzed, the influencing factors are discussed, the analysis techniques for RS and distortion are introduced, and the mitigation strategies applicable to different stages of arc-DED are summarized. The paper concludes by providing a prospective outlook on future research directions for mitigating RS and distortion. This review serves as a valuable reference for manufacturing parts with minimal RS and distortion in industrial arc-DED applications.
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来源期刊
Journal of Manufacturing Processes
Journal of Manufacturing Processes ENGINEERING, MANUFACTURING-
CiteScore
10.20
自引率
11.30%
发文量
833
审稿时长
50 days
期刊介绍: The aim of the Journal of Manufacturing Processes (JMP) is to exchange current and future directions of manufacturing processes research, development and implementation, and to publish archival scholarly literature with a view to advancing state-of-the-art manufacturing processes and encouraging innovation for developing new and efficient processes. The journal will also publish from other research communities for rapid communication of innovative new concepts. Special-topic issues on emerging technologies and invited papers will also be published.
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