A. Shmalko, A. Zakharov, E. Khairullina, I. Tumkin, D. Shestakov, A. Komlev, E. Danilovskiy, A. Manshina, L. Logunov
{"title":"Direct Laser Metallization from Deep Eutectic Solvents on Polymer Substrates","authors":"A. Shmalko, A. Zakharov, E. Khairullina, I. Tumkin, D. Shestakov, A. Komlev, E. Danilovskiy, A. Manshina, L. Logunov","doi":"10.1134/S1062873824709887","DOIUrl":null,"url":null,"abstract":"<p>The task of local metallization of polymer substrates such as PDMS (polydimethylsiloxane) is a challenging and important task for the development of biocompatible flexible electronics. Here we present for the first time the possibility of using the Direct laser metallization (DLM) method for fabrication of copper conducting structures on PDMS. It has been shown that DLM method allows one to obtain conductive structures with low resistivity and a developed surface with minimal thermal impact on the substrate. By optimizing the scanning speed and laser power density, it was possible to minimize the thermal degradation of PDMS and ensure reliable metal adhesion. The DLM method opens up new opportunities for creating flexible electronics, providing precise and cost-effective deposition of copper conductors on flexible substrates.</p>","PeriodicalId":504,"journal":{"name":"Bulletin of the Russian Academy of Sciences: Physics","volume":"88 3 supplement","pages":"S385 - S389"},"PeriodicalIF":0.4800,"publicationDate":"2025-01-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Bulletin of the Russian Academy of Sciences: Physics","FirstCategoryId":"1085","ListUrlMain":"https://link.springer.com/article/10.1134/S1062873824709887","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q4","JCRName":"Physics and Astronomy","Score":null,"Total":0}
引用次数: 0
Abstract
The task of local metallization of polymer substrates such as PDMS (polydimethylsiloxane) is a challenging and important task for the development of biocompatible flexible electronics. Here we present for the first time the possibility of using the Direct laser metallization (DLM) method for fabrication of copper conducting structures on PDMS. It has been shown that DLM method allows one to obtain conductive structures with low resistivity and a developed surface with minimal thermal impact on the substrate. By optimizing the scanning speed and laser power density, it was possible to minimize the thermal degradation of PDMS and ensure reliable metal adhesion. The DLM method opens up new opportunities for creating flexible electronics, providing precise and cost-effective deposition of copper conductors on flexible substrates.
期刊介绍:
Bulletin of the Russian Academy of Sciences: Physics is an international peer reviewed journal published with the participation of the Russian Academy of Sciences. It presents full-text articles (regular, letters to the editor, reviews) with the most recent results in miscellaneous fields of physics and astronomy: nuclear physics, cosmic rays, condensed matter physics, plasma physics, optics and photonics, nanotechnologies, solar and astrophysics, physical applications in material sciences, life sciences, etc. Bulletin of the Russian Academy of Sciences: Physics focuses on the most relevant multidisciplinary topics in natural sciences, both fundamental and applied. Manuscripts can be submitted in Russian and English languages and are subject to peer review. Accepted articles are usually combined in thematic issues on certain topics according to the journal editorial policy. Authors featured in the journal represent renowned scientific laboratories and institutes from different countries, including large international collaborations. There are globally recognized researchers among the authors: Nobel laureates and recipients of other awards, and members of national academies of sciences and international scientific societies.