A comprehensive review of welding defect recognition from X-ray images

IF 6.1 1区 工程技术 Q1 ENGINEERING, MANUFACTURING
Xiaopeng Wang , Uwe Zscherpel , Paolo Tripicchio , Salvatore D'Avella , Baoxin Zhang , Juntao Wu , Zhimin Liang , Shaoxin Zhou , Xinghua Yu
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引用次数: 0

Abstract

The evaluation of radiographic indications in welds plays a critical role in the quality assurance of the manufacturing process for metal products. The traditional visual approach for the evaluation of defects is inefficient and inconsistent. Various techniques for automated defect recognition of indications in weld radiographs have been proposed in the last three decades. In recent years, notable progresses have been made with the development of deep learning-based techniques. However, to date, the literature still lacks a comprehensive review of automated defect recognition in radiographic images. Therefore, this paper reviews the automated defect recognition in X-ray weld inspection, including traditional and deep-learning-based techniques. The review of traditional techniques is outlined from the perspective of image pre-processing, feature extraction, and defect analysis and evaluation. Deep-learning-based methods are reviewed from the perspective of datasets and networks structures, discussing the techniques employed to solve the small datasets problem, segmentation and classification of defects in welds. Finally, potential advancements in automated weld inspection techniques are drawn.
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来源期刊
Journal of Manufacturing Processes
Journal of Manufacturing Processes ENGINEERING, MANUFACTURING-
CiteScore
10.20
自引率
11.30%
发文量
833
审稿时长
50 days
期刊介绍: The aim of the Journal of Manufacturing Processes (JMP) is to exchange current and future directions of manufacturing processes research, development and implementation, and to publish archival scholarly literature with a view to advancing state-of-the-art manufacturing processes and encouraging innovation for developing new and efficient processes. The journal will also publish from other research communities for rapid communication of innovative new concepts. Special-topic issues on emerging technologies and invited papers will also be published.
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