Scratch and grinding behavior of different cemented carbide grades for cutting inserts

IF 6.1 1区 工程技术 Q1 ENGINEERING, MANUFACTURING
B.O. da Silva , S. Huang , J. Vleugels , V. Seriacopi , I.F. Machado , D.C. Cruz , C.E.H. Ventura
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引用次数: 0

Abstract

Material removal mechanisms and grinding characteristics of brittle materials are commonly analyzed based on their mechanical and tribological properties. However, the distinctly operating conditions between laboratory tests and real processes are commonly neglected, and associations cannot always be made. Within this context and to analyze possible correlations between material properties (mechanical and tribological) and their grindability, different commercial (WC-Co based K10, M10, and P10) and customized (NbC-Ni based) cemented carbide grades applied as cutting tools had their hardness and fracture toughness measured, and were investigated through scratch and grinding experiments. The process forces, specific energy, and surface and edge quality were assessed during grinding, while the apparent coefficient of friction, material removal factor, specific energy, and groove integrity were analyzed during scratching. No clear correlation could be found between the mechanical/tribological properties and grindability, indicating that, from a process point of view, the difficulty associated with grinding of all investigated cemented carbides is similar, despite of different hardness-toughness combinations.
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来源期刊
Journal of Manufacturing Processes
Journal of Manufacturing Processes ENGINEERING, MANUFACTURING-
CiteScore
10.20
自引率
11.30%
发文量
833
审稿时长
50 days
期刊介绍: The aim of the Journal of Manufacturing Processes (JMP) is to exchange current and future directions of manufacturing processes research, development and implementation, and to publish archival scholarly literature with a view to advancing state-of-the-art manufacturing processes and encouraging innovation for developing new and efficient processes. The journal will also publish from other research communities for rapid communication of innovative new concepts. Special-topic issues on emerging technologies and invited papers will also be published.
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