Preparation of Sn42Bi58 and Sn64.7Bi35Ag0.3 soldering pastes for Cu–Al direct soldering and study of their performance

IF 4.3 3区材料科学 Q2 MATERIALS SCIENCE, MULTIDISCIPLINARY

Materials Chemistry and Physics Pub Date : 2025-02-14 DOI:10.1016/j.matchemphys.2025.130547

Ruofan Wang, Yanfu Yan, Wenjun Li, Zhiming Li

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引用次数: 0

Abstract

Cu–Al soft soldering plays a crucial role in the fabrication of Cu–Al composites. In this study, a new rosin-type flux for Cu–Al direct soldering was synthesized, and G-1 (Sn42Bi58 paste) and G-2 (Sn64.7Bi35Ag0.3 paste) soft soldering pastes were prepared. The results of flux physicochemical tests are as follows: density 1.11 g/cm³, pH 5.2, viscosity 32 Pa s, and non-corrosive to the copper plate. These are in line with the requirements for soldering applications. The wettability test results show that G-1 and G-2 displayed good wettability on the Cu and Al plates. This is in line with the standard Cu–Al soft soldering paste. The mechanical property test showed that G-2 had better mechanical properties than G-1, with a tensile strength of 112.57 MPa. SEM revealed that the IMC (intermetallic compound) layer of G-1 was flatter than that of G-2. This is closely related to the fact that the Ag in Sn64.7Bi35Ag0.3 powders can reduce the enrichment of metallic Bi and refine the grains.

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来源期刊

Materials Chemistry and Physics 工程技术-材料科学：综合

CiteScore

8.70

自引率

4.30%

发文量

1515

审稿时长

69 days

期刊介绍： Materials Chemistry and Physics is devoted to short communications, full-length research papers and feature articles on interrelationships among structure, properties, processing and performance of materials. The Editors welcome manuscripts on thin films, surface and interface science, materials degradation and reliability, metallurgy, semiconductors and optoelectronic materials, fine ceramics, magnetics, superconductors, specialty polymers, nano-materials and composite materials.