Force-Field Benchmark for Polydimethylsiloxane: Density, Heat Capacity, Isothermal Compressibility, Viscosity and Thermal Conductivity

IF 2.9 2区 化学 Q3 CHEMISTRY, PHYSICAL
Zhirui Xiang, Chao Gao, Teng Long, Lifeng Ding, Tianhang Zhou and Zhenghao Wu*, 
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引用次数: 0

Abstract

Polysiloxanes are versatile polymeric materials with widespread applications in industries ranging from electronics to biomedical devices because of their unique thermal and viscoelastic properties. Accurate molecular simulations of polysiloxanes are essential for understanding their broad applications from a microscopic perspective. However, the accuracy of these simulations is highly dependent on the quality of the force fields used. In this work, we present a comprehensive benchmark and development of force fields tailored for polydimethylsiloxane, which is one of the most widely used polysiloxane materials. Our focus is on their performance in predicting key thermophysical properties including density, heat capacities, isothermal compressibility, and transport properties such as viscosity and thermal conductivity. Experimental measurements are performed in parallel to rigorously validate simulation outcomes. Existing force fields for polydimethylsiloxane, including those derived for organic and inorganic systems, are systematically evaluated against experimental data to identify limitations in accuracy and transferability. Simulation results are compared extensively with experimental observations across a range of temperatures and pressures, revealing the strengths and shortcomings of these commonly utilized force fields for polydimethylsiloxane. Discrepancies between force field predictions and experimental measurements are analyzed in detail for thermodynamic and transport properties of polydimethylsiloxane. This benchmark study serves as a critical assessment of current force fields for polydimethylsiloxane and offers guidelines for their further development, enabling more reliable simulations of polysiloxane-based materials for various industrial applications.

聚二甲基硅氧烷的力场基准:密度,热容量,等温压缩性,粘度和导热性
聚硅氧烷是一种多用途的高分子材料,由于其独特的热和粘弹性,广泛应用于从电子到生物医学设备等行业。精确的聚硅氧烷分子模拟对于从微观角度理解其广泛应用至关重要。然而,这些模拟的准确性高度依赖于所用力场的质量。本文介绍了应用最广泛的聚硅氧烷材料之一聚二甲基硅氧烷专用力场的综合基准和发展。我们的重点是它们在预测关键热物理性质方面的性能,包括密度、热容、等温压缩性和传输性质,如粘度和导热性。并行进行实验测量,以严格验证模拟结果。现有的聚二甲基硅氧烷力场,包括有机和无机体系的力场,根据实验数据进行系统评估,以确定准确性和可转移性的局限性。将模拟结果与实验观察结果在一定温度和压力下进行了广泛的比较,揭示了这些常用力场对聚二甲基硅氧烷的优缺点。详细分析了聚二甲基硅氧烷热力学和输运性质的力场预测与实验测量的差异。本基准研究是对聚二甲基硅氧烷当前力场的关键评估,并为其进一步发展提供指导,为各种工业应用提供更可靠的聚硅氧烷基材料模拟。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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来源期刊
CiteScore
5.80
自引率
9.10%
发文量
965
审稿时长
1.6 months
期刊介绍: An essential criterion for acceptance of research articles in the journal is that they provide new physical insight. Please refer to the New Physical Insights virtual issue on what constitutes new physical insight. Manuscripts that are essentially reporting data or applications of data are, in general, not suitable for publication in JPC B.
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