A. V. Shelyakov, N. N. Sitnikov, D. A. Khachatrian, I. A. Zaletova
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引用次数: 0
Abstract
Layered amorphous-crystalline TiNiCu alloy ribbons produced by ultrarapid quenching from the liquid state (melt spinning technique) show the two-way shape memory effect without additional processing, which makes them applicable to various micromechanical devices (microtweezers) for gripping and manipulating microobjects. The present work is devoted to the study of the influence of the rejuvenation process (cryogenic thermal cycling) and the thickness of the crystalline layer on the structure and functional properties of quasi-binary TiNi-TiCu alloy with the copper content 25 at %. It is shown that thickening of the crystalline layer significantly increases not only the enthalpy of martensitic transformation but also its critical temperatures and affects the alloy crystallization pattern and temperatures. Rejuvenation treatment transforms the interface between the amorphous and crystalline layers and changes the ratio between the B19 martensitic phase and the residual B2 austenitic phase in the martensitic state, which affects the martensitic transformation parameters. In addition, cryothermal treatment causes a noticeable increase in reversible strain (magnitude of the two-way shape memory effect) and significantly narrows the temperature hysteresis of shape changing, which can improve the functional properties of microdevices based on rapidly quenched amorphous-crystalline ribbons.
由液态超快速淬火(熔体纺丝技术)制备的层状非晶TiNiCu合金带具有双向形状记忆效应,无需额外加工,适用于各种微机械设备(微镊子),用于抓取和操纵微物体。本文研究了回火过程(低温热循环)和晶层厚度对含铜量为25% at %的准二元ti - ticu合金结构和功能性能的影响。结果表明,晶层增厚不仅显著提高了马氏体相变焓,而且显著提高了马氏体相变的临界温度,影响了合金的结晶方式和结晶温度。回火处理改变了非晶层与晶层之间的界面,改变了马氏体状态下B19马氏体相与残余B2奥氏体相的比值,影响了马氏体相变参数。此外,低温热处理导致可逆应变(双向形状记忆效应的大小)显著增加,形状变化的温度滞后显著缩小,可以改善基于快速淬火非晶带的微器件的功能性能。
期刊介绍:
The journal provides an international medium for the publication of theoretical and experimental studies and reviews related in the physical mesomechanics and also solid-state physics, mechanics, materials science, geodynamics, non-destructive testing and in a large number of other fields where the physical mesomechanics may be used extensively. Papers dealing with the processing, characterization, structure and physical properties and computational aspects of the mesomechanics of heterogeneous media, fracture mesomechanics, physical mesomechanics of materials, mesomechanics applications for geodynamics and tectonics, mesomechanics of smart materials and materials for electronics, non-destructive testing are viewed as suitable for publication.