Monitoring of Argon plasma in a coating manufacturing process by utilising IR imaging techniques

IF 6.1 1区 工程技术 Q1 ENGINEERING, MANUFACTURING
David Miller , V. Viswanathan , Divya Tiwari , Windo Hutabarat , Saurav Goel , Beth Muthoni Irungu , Allan Matthews , Ashutosh Tiwari
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Abstract

Atmospheric plasma spray is a complex multivariable manufacturing process used in a wide range of industries. Deviations in the process parameters have been shown to affect the coating quality. Currently, the quality analysis is performed at the end of the process rather than checking for defects during the process. However, monitoring for these deviations during a coating process is difficult due to environmental hazards such as UV radiation, dusty environment, and excessive noise generation. A commercially available thermal imaging camera was integrated into this space to directly monitor the atmospheric plasma heat distribution and its influence on the in-flight particle trajectories during spraying. A novel metric called asymmetric angle is proposed to monitor the asymmetry of the plasma heat distribution. This is an important metric as a symmetric heat distribution is required to heat all the particles adequately to form a good quality coating. Further metrics of Gaussian Aspect Ratio (GAR) and contour area were found to have a relationship with the plasma gas flow rate and are discussed. The spray angle of the material is also tracked by fitting a 1D line to the regional Shannon entropy of the thermal image. The limitations of these metrics are discussed with possible avenues of further investigation.
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来源期刊
Journal of Manufacturing Processes
Journal of Manufacturing Processes ENGINEERING, MANUFACTURING-
CiteScore
10.20
自引率
11.30%
发文量
833
审稿时长
50 days
期刊介绍: The aim of the Journal of Manufacturing Processes (JMP) is to exchange current and future directions of manufacturing processes research, development and implementation, and to publish archival scholarly literature with a view to advancing state-of-the-art manufacturing processes and encouraging innovation for developing new and efficient processes. The journal will also publish from other research communities for rapid communication of innovative new concepts. Special-topic issues on emerging technologies and invited papers will also be published.
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