3D printing of microwave materials, components and their applications – A review

IF 6.1 1区 工程技术 Q1 ENGINEERING, MANUFACTURING
Ravina R. Holkar, Govind G. Umarji, Manish D. Shinde, Sunit B. Rane
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引用次数: 0

Abstract

Additive manufacturing (AM) or 3D printing is gaining a lot of ground as an alternative manufacturing technology to conventional methods owing to its easy customization, less wastage and more economical aspects. However, it is still in infancy as far as the development of microwave materials and strategies of their printing is concerned. Though the work in this direction has started a decade ago, significant developments have taken place over the last five years. However, there is still a dearth of an extensive review related to the contemporary developments in this field which can assist the researchers to accordingly align their research acumen for converging their expertise with AM technology. The developments pertaining to microwave materials, 3D printing processes of such materials and their applications as various microwave components and devices are presented in this review. Additionally, the reported results on microwave dielectric properties of 3D printed components and their applications are discussed. The challenges associated with 3D printing of microwave materials and components are also elaborated. Finally, the future scope of 3D printing technology in this area is presented.
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来源期刊
Journal of Manufacturing Processes
Journal of Manufacturing Processes ENGINEERING, MANUFACTURING-
CiteScore
10.20
自引率
11.30%
发文量
833
审稿时长
50 days
期刊介绍: The aim of the Journal of Manufacturing Processes (JMP) is to exchange current and future directions of manufacturing processes research, development and implementation, and to publish archival scholarly literature with a view to advancing state-of-the-art manufacturing processes and encouraging innovation for developing new and efficient processes. The journal will also publish from other research communities for rapid communication of innovative new concepts. Special-topic issues on emerging technologies and invited papers will also be published.
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