Strengthening mechanisms and deformation behavior of Au/Ag bilayer using nanoindentation

IF 2.1 4区 物理与天体物理 Q3 PHYSICS, CONDENSED MATTER
H. Mes-adi , M. Lablali , M. Ait ichou , K. Saadouni , M. Mazroui
{"title":"Strengthening mechanisms and deformation behavior of Au/Ag bilayer using nanoindentation","authors":"H. Mes-adi ,&nbsp;M. Lablali ,&nbsp;M. Ait ichou ,&nbsp;K. Saadouni ,&nbsp;M. Mazroui","doi":"10.1016/j.ssc.2025.115844","DOIUrl":null,"url":null,"abstract":"<div><div>Thin-film coatings of metals, particularly Gold (Au) and Silver (Ag), have proven to be highly promising for improving the performance and efficiency of micro/nano-electromechanical systems (MEMS/NEMS). This interest needs to explore their mechanical properties. Here, nanoindentation is used to investigate the details of deformation mechanisms and mechanical properties of Au coating film on Ag substrate using molecular dynamics (MD) simulations. The effects of coating Au thickness and indentation velocity on the indented Au/Ag bilayers are investigated by analyzing the load-displacement, hardness, structure and dislocation movement. Most interestingly, the results reveal that the Au/Ag bilayer exhibits significant strengthening when the thickness of the coating Au film is decreased. It is found that the values of force and hardness increase as the coating Au film thickness decreases. Based on extraction dislocations analysis (DXA), a large number of dislocations propagate through the interface when the Au film thickness is below 12 Å. In addition, the variation of indentation velocity shows a significant effect on the mechanical properties of Au/Ag bilayers. The Common Neighbor Analysis (CNA) demonstrates that more defects are generated during nanoindentation process. Accordingly, the force and hardness are found to increase with increasing indentation velocity.</div></div>","PeriodicalId":430,"journal":{"name":"Solid State Communications","volume":"397 ","pages":"Article 115844"},"PeriodicalIF":2.1000,"publicationDate":"2025-01-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Solid State Communications","FirstCategoryId":"101","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S0038109825000195","RegionNum":4,"RegionCategory":"物理与天体物理","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"PHYSICS, CONDENSED MATTER","Score":null,"Total":0}
引用次数: 0

Abstract

Thin-film coatings of metals, particularly Gold (Au) and Silver (Ag), have proven to be highly promising for improving the performance and efficiency of micro/nano-electromechanical systems (MEMS/NEMS). This interest needs to explore their mechanical properties. Here, nanoindentation is used to investigate the details of deformation mechanisms and mechanical properties of Au coating film on Ag substrate using molecular dynamics (MD) simulations. The effects of coating Au thickness and indentation velocity on the indented Au/Ag bilayers are investigated by analyzing the load-displacement, hardness, structure and dislocation movement. Most interestingly, the results reveal that the Au/Ag bilayer exhibits significant strengthening when the thickness of the coating Au film is decreased. It is found that the values of force and hardness increase as the coating Au film thickness decreases. Based on extraction dislocations analysis (DXA), a large number of dislocations propagate through the interface when the Au film thickness is below 12 Å. In addition, the variation of indentation velocity shows a significant effect on the mechanical properties of Au/Ag bilayers. The Common Neighbor Analysis (CNA) demonstrates that more defects are generated during nanoindentation process. Accordingly, the force and hardness are found to increase with increasing indentation velocity.
纳米压痕强化Au/Ag双分子层的机理及变形行为
金属薄膜涂层,特别是金(Au)和银(Ag),已被证明在提高微/纳米机电系统(MEMS/NEMS)的性能和效率方面具有很大的前景。这种兴趣需要探索它们的机械性能。本文采用分子动力学(MD)模拟方法,利用纳米压痕技术研究了Ag衬底上Au涂层的变形机理和力学性能。通过对压痕层的载荷位移、硬度、结构和位错运动的分析,研究了镀层厚度和压痕速度对压痕层的影响。最有趣的是,结果表明,当镀层厚度减小时,Au/Ag双分子层表现出明显的强化。结果表明,随着镀层厚度的减小,力值和硬度值均增大。基于萃取位错分析(DXA),当Au膜厚度小于12 Å时,大量位错通过界面传播。此外,压痕速度的变化对Au/Ag双分子层的力学性能有显著影响。共邻分析(CNA)表明,在纳米压痕过程中会产生更多的缺陷。因此,随着压痕速度的增加,力和硬度也随之增加。
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来源期刊
Solid State Communications
Solid State Communications 物理-物理:凝聚态物理
CiteScore
3.40
自引率
4.80%
发文量
287
审稿时长
51 days
期刊介绍: Solid State Communications is an international medium for the publication of short communications and original research articles on significant developments in condensed matter science, giving scientists immediate access to important, recently completed work. The journal publishes original experimental and theoretical research on the physical and chemical properties of solids and other condensed systems and also on their preparation. The submission of manuscripts reporting research on the basic physics of materials science and devices, as well as of state-of-the-art microstructures and nanostructures, is encouraged. A coherent quantitative treatment emphasizing new physics is expected rather than a simple accumulation of experimental data. Consistent with these aims, the short communications should be kept concise and short, usually not longer than six printed pages. The number of figures and tables should also be kept to a minimum. Solid State Communications now also welcomes original research articles without length restrictions. The Fast-Track section of Solid State Communications is the venue for very rapid publication of short communications on significant developments in condensed matter science. The goal is to offer the broad condensed matter community quick and immediate access to publish recently completed papers in research areas that are rapidly evolving and in which there are developments with great potential impact.
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