Vacuum brazing of Ti2AlNb alloy with AgCu/Ti/AgCu sandwich filler metal.

IF 4.3 2区材料科学 Q2 CHEMISTRY, PHYSICAL

Intermetallics Pub Date : 2025-02-03 DOI:10.1016/j.intermet.2025.108691

Jingkuan Wang , Peng Li , Zhenyang Zhang , Xiong Ma , Yinchen Wang , Zhijie Ding , Honggang Dong

引用次数: 0

Abstract

An AgCu/Ti/AgCu sandwich filler metal was designed to achieve sound joining of Ti₂AlNb alloy at low brazing temperature. The effects of brazing parameters on the microstructure, mechanical properties, and fracture behavior of the resultant joints were investigated. The typical microstructure of the joint was Ti₂AlNb/AlCu₂Ti + Nb_{(s, s)}/Ag_{(s, s)} + Cu_{(s, s)} + Cu₄Ti₃/AlCu₂Ti + Nb_{(s, s)}/Ti₂AlNb. With the increment of the brazing temperature and the holding time, the fracture paths were shifted from Zone Ⅰ to Zone Ⅱ and then to Zone Ⅰ. The shear strength of the joints indicated a trend of increasing and then sharply decreasing. The shear strength reached 292.67 MPa at 900 °C for 10 min, and the fracture morphology exhibited the mixed tough-brittle feature.

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来源期刊

Intermetallics 工程技术-材料科学：综合

CiteScore

7.80

自引率

9.10%

发文量

291

审稿时长

37 days

期刊介绍： This journal is a platform for publishing innovative research and overviews for advancing our understanding of the structure, property, and functionality of complex metallic alloys, including intermetallics, metallic glasses, and high entropy alloys. The journal reports the science and engineering of metallic materials in the following aspects: Theories and experiments which address the relationship between property and structure in all length scales. Physical modeling and numerical simulations which provide a comprehensive understanding of experimental observations. Stimulated methodologies to characterize the structure and chemistry of materials that correlate the properties. Technological applications resulting from the understanding of property-structure relationship in materials. Novel and cutting-edge results warranting rapid communication. The journal also publishes special issues on selected topics and overviews by invitation only.