Investigation on the microstructure evolution and strengthening behavior of rolled bonding Cu strip

IF 6.7 3区 材料科学 Q1 MATERIALS SCIENCE, MULTIDISCIPLINARY
Jun Cao , Junchao Zhang , Huiyi Tang , Xiaoyu Shen , Kexing Song , Yanjun Zhou , Chengqiang Cui
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引用次数: 0

Abstract

The relationship and influencing mechanism among the reduction rate, the strengthening behavior and the microstructure evolution of rolled Cu strips were studied. It was found that with the increase of reduction rate, the uneven deformation behavior of the Cu strip was divided into three zones. The grain size in Zone I was refined accompanied by large-scale entangled dislocations, and a nanosheet layered texture was formed. The primary reason for the increase in the strength of the Cu strip is the combined strengthening effect of dislocation, grain boundary and texture, as well as the strengthening effect provided by some lattice friction. The grain orientation exhibited periodic transitions between <110> and <111>, <001>, which provides assistance for grain refinement and dislocation accumulation. The grains in the fracture zone of the Cu strip are elongated and refined during stretching, and flow towards the central axis of the cross-section. The fracture mechanism has shifted from cutting to a chip edge/point to a combined action of multiple mechanisms, which is also accompanied by a gradual increase in the “tearing angle".
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来源期刊
Journal of Science: Advanced Materials and Devices
Journal of Science: Advanced Materials and Devices Materials Science-Electronic, Optical and Magnetic Materials
CiteScore
11.90
自引率
2.50%
发文量
88
审稿时长
47 days
期刊介绍: In 1985, the Journal of Science was founded as a platform for publishing national and international research papers across various disciplines, including natural sciences, technology, social sciences, and humanities. Over the years, the journal has experienced remarkable growth in terms of quality, size, and scope. Today, it encompasses a diverse range of publications dedicated to academic research. Considering the rapid expansion of materials science, we are pleased to introduce the Journal of Science: Advanced Materials and Devices. This new addition to our journal series offers researchers an exciting opportunity to publish their work on all aspects of materials science and technology within the esteemed Journal of Science. With this development, we aim to revolutionize the way research in materials science is expressed and organized, further strengthening our commitment to promoting outstanding research across various scientific and technological fields.
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