Design and synthesis of fluorinated polyimides with low thermal expansion and enhanced dielectric properties.

IF 9.4 1区 化学 Q1 CHEMISTRY, PHYSICAL
Journal of Colloid and Interface Science Pub Date : 2025-05-01 Epub Date: 2025-01-23 DOI:10.1016/j.jcis.2025.01.197
Yang Li, Zhong-Wen Pu, Zhi-Zhou Yang, Yi-Da Wang, Yu-Tang Shen, Jing-Bo Wu, Lingliang Long, Yin-Ning Zhou, Wei-Cheng Yan
{"title":"Design and synthesis of fluorinated polyimides with low thermal expansion and enhanced dielectric properties.","authors":"Yang Li, Zhong-Wen Pu, Zhi-Zhou Yang, Yi-Da Wang, Yu-Tang Shen, Jing-Bo Wu, Lingliang Long, Yin-Ning Zhou, Wei-Cheng Yan","doi":"10.1016/j.jcis.2025.01.197","DOIUrl":null,"url":null,"abstract":"<p><p>Modern microelectronics industries urgently require dielectric materials with low thermal expansion coefficients, low dielectric constants, and minimal dielectric loss. However, the design principles of materials with low dielectric constants and low thermal expansion are contradictory. In this study, a new diamine monomer containing a dibenzocyclooctadiene unit (DBCOD-NH<sub>2</sub>) was designed and synthesized, which was subsequently polymerized with high fluorine content 4,4'-hexafluoroisopr-opylidene diphthalic anhydride and 4,4'-diamino-2,2'-bis(trifleoromethyl)biphenyl to obtain a series of fluorinated polyimides (PIs). Due to the unique conformational transition of the eight-membered carbon ring, the resulting PI can reach a low averaging thermal expansion coefficient (CTE) of only 12.27 ppm/K over 5-150 ℃ with a size change rate of only 0.16 %. Surprisingly, the synergistic effect of DBCOD-NH<sub>2</sub> with the other two monomers enhances the dielectric performance of the PIs. At an electric field frequency of 10 MHz, the dielectric constant (D<sub>k</sub>) and the dielectric loss (D<sub>f</sub>) can be reduced to as low as 2.61 and 0.00194, respectively. The strategy used herein largely tackles the challenge of balancing low D<sub>k</sub> with low CTE. Furthermore, these PI films also exhibit good thermal stability (with 5 wt% weight loss temperatures ranging from 453 to 537 ℃ in N<sub>2</sub>, and glass transition temperatures of 305-337 ℃) and robust mechanical properties (with a tensile modulus of 1.88-2.29 GPa and an elongation at break of 6.36-8.11 %). The combination of low thermal expansion and excellent dielectric properties renders these PIs highly promising for applications in the microelectronics and telecommunications industries.</p>","PeriodicalId":351,"journal":{"name":"Journal of Colloid and Interface Science","volume":"685 ","pages":"938-947"},"PeriodicalIF":9.4000,"publicationDate":"2025-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Colloid and Interface Science","FirstCategoryId":"92","ListUrlMain":"https://doi.org/10.1016/j.jcis.2025.01.197","RegionNum":1,"RegionCategory":"化学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"2025/1/23 0:00:00","PubModel":"Epub","JCR":"Q1","JCRName":"CHEMISTRY, PHYSICAL","Score":null,"Total":0}
引用次数: 0

Abstract

Modern microelectronics industries urgently require dielectric materials with low thermal expansion coefficients, low dielectric constants, and minimal dielectric loss. However, the design principles of materials with low dielectric constants and low thermal expansion are contradictory. In this study, a new diamine monomer containing a dibenzocyclooctadiene unit (DBCOD-NH2) was designed and synthesized, which was subsequently polymerized with high fluorine content 4,4'-hexafluoroisopr-opylidene diphthalic anhydride and 4,4'-diamino-2,2'-bis(trifleoromethyl)biphenyl to obtain a series of fluorinated polyimides (PIs). Due to the unique conformational transition of the eight-membered carbon ring, the resulting PI can reach a low averaging thermal expansion coefficient (CTE) of only 12.27 ppm/K over 5-150 ℃ with a size change rate of only 0.16 %. Surprisingly, the synergistic effect of DBCOD-NH2 with the other two monomers enhances the dielectric performance of the PIs. At an electric field frequency of 10 MHz, the dielectric constant (Dk) and the dielectric loss (Df) can be reduced to as low as 2.61 and 0.00194, respectively. The strategy used herein largely tackles the challenge of balancing low Dk with low CTE. Furthermore, these PI films also exhibit good thermal stability (with 5 wt% weight loss temperatures ranging from 453 to 537 ℃ in N2, and glass transition temperatures of 305-337 ℃) and robust mechanical properties (with a tensile modulus of 1.88-2.29 GPa and an elongation at break of 6.36-8.11 %). The combination of low thermal expansion and excellent dielectric properties renders these PIs highly promising for applications in the microelectronics and telecommunications industries.

具有低热膨胀和增强介电性能的氟化聚酰亚胺的设计和合成。
现代微电子工业迫切需要具有低热膨胀系数、低介电常数和最小介电损耗的介电材料。然而,低介电常数和低热膨胀材料的设计原则是矛盾的。本研究设计并合成了一种含二苯并环二烯单元(DBCOD-NH2)的新型二胺单体,并与高氟含量的4,4′-六氟异丙偏二苯二酸酐和4,4′-二氨基-2,2′-双(三氟甲基)联苯进行聚合,得到了一系列含氟聚酰亚胺(pi)。由于八元碳环独特的构象转变,得到的PI在5-150℃范围内平均热膨胀系数(CTE)仅为12.27 ppm/K,尺寸变化率仅为0.16%。令人惊讶的是,DBCOD-NH2与其他两种单体的协同作用提高了pi的介电性能。在电场频率为10 MHz时,介质常数Dk和介质损耗Df分别可降至2.61和0.00194。本文使用的策略在很大程度上解决了平衡低Dk和低CTE的挑战。此外,这些PI薄膜还表现出良好的热稳定性(在453 ~ 537℃的氮气中失重5 wt%,玻璃化转变温度为305 ~ 337℃)和坚固的机械性能(拉伸模量为1.88 ~ 2.29 GPa,断裂伸长率为6.36 ~ 8.11%)。低热膨胀和优异介电性能的结合使得这些pi在微电子和电信行业的应用非常有前途。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 求助全文
来源期刊
CiteScore
16.10
自引率
7.10%
发文量
2568
审稿时长
2 months
期刊介绍: The Journal of Colloid and Interface Science publishes original research findings on the fundamental principles of colloid and interface science, as well as innovative applications in various fields. The criteria for publication include impact, quality, novelty, and originality. Emphasis: The journal emphasizes fundamental scientific innovation within the following categories: A.Colloidal Materials and Nanomaterials B.Soft Colloidal and Self-Assembly Systems C.Adsorption, Catalysis, and Electrochemistry D.Interfacial Processes, Capillarity, and Wetting E.Biomaterials and Nanomedicine F.Energy Conversion and Storage, and Environmental Technologies
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术官方微信