Performance of Twinning-Induced Plasticity Steel Processed by Multipass Equal Channel Angular Pressing at High Temperatures

IF 1.8 4区材料科学 Q2 MATERIALS SCIENCE, CHARACTERIZATION & TESTING

Physical Mesomechanics Pub Date : 2024-12-08 DOI:10.1134/S1029959924060079

N. A. Enikeev, M. M. Abramova, I. V. Smirnov, A. M. Mavlyutov, J. G. Kim, C. S. Lee, H. S. Kim

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Abstract

The present paper deals with twinning-induced plasticity (TWIP) steels with the microstructure refined by severe plastic deformation via equal channel angular pressing and explores the mechanical behavior of steel with qualitatively different microstructures formed in the temperature range 400–900°C. Mechanical characteristics of the steel in different structural states are studied in static tensile tests, biaxial and dynamic tests. Structural changes in the material during severe deformation at different temperatures are discussed, and their effect on the mechanical parameters of TWIP steel is considered. High temperatures of equal channel angular pressing allow for more homogeneous recrystallized structures, which ensure the best combination of the yield stress, formability, plasticity, and crack resistance. These findings can be important in developing high-performance steels for the automotive and hydrogen industries.

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来源期刊

Physical Mesomechanics Materials Science-General Materials Science

CiteScore

3.50

自引率

18.80%

发文量

期刊介绍： The journal provides an international medium for the publication of theoretical and experimental studies and reviews related in the physical mesomechanics and also solid-state physics, mechanics, materials science, geodynamics, non-destructive testing and in a large number of other fields where the physical mesomechanics may be used extensively. Papers dealing with the processing, characterization, structure and physical properties and computational aspects of the mesomechanics of heterogeneous media, fracture mesomechanics, physical mesomechanics of materials, mesomechanics applications for geodynamics and tectonics, mesomechanics of smart materials and materials for electronics, non-destructive testing are viewed as suitable for publication.