Localized surface plasmon resonance of a Cu nanodot array covered with a native oxidation layer

IF 0.8 4区 物理与天体物理 Q3 PHYSICS, MULTIDISCIPLINARY
Mi Jung
{"title":"Localized surface plasmon resonance of a Cu nanodot array covered with a native oxidation layer","authors":"Mi Jung","doi":"10.1007/s40042-024-01185-6","DOIUrl":null,"url":null,"abstract":"<div><p>Exploring the localized surface plasmon resonance (LSPR) of Cu nanostructures with native oxidation layers is very important for attaining plasmonic applications. A Cu nanodot array (NDA) was fabricated on an indium tin oxide substrate using an anodic aluminum-oxide layer with through-holes as a shadow mask. The surface chemical states and plasmonic properties of the Cu NDA and Cu film prepared for comparison were investigated via X-ray photoelectron spectroscopy (XPS) and ultraviolet‒visible spectroscopy. The XPS-depth profile indicated that the native oxide layer on the 50-nm-thick deposited Cu film was approximately 4.3 nm thick. For the Cu film, an absorption dip was observed at 573 nm, with two shoulder peaks attributed to the surface-oxide layer. The LSPR of the Cu NDA with a dot diameter of 60(± 5) nm was clearly observed at 652 nm despite the presence of a native oxide layer.</p></div>","PeriodicalId":677,"journal":{"name":"Journal of the Korean Physical Society","volume":"85 11","pages":"931 - 936"},"PeriodicalIF":0.8000,"publicationDate":"2024-09-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of the Korean Physical Society","FirstCategoryId":"101","ListUrlMain":"https://link.springer.com/article/10.1007/s40042-024-01185-6","RegionNum":4,"RegionCategory":"物理与天体物理","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"PHYSICS, MULTIDISCIPLINARY","Score":null,"Total":0}
引用次数: 0

Abstract

Exploring the localized surface plasmon resonance (LSPR) of Cu nanostructures with native oxidation layers is very important for attaining plasmonic applications. A Cu nanodot array (NDA) was fabricated on an indium tin oxide substrate using an anodic aluminum-oxide layer with through-holes as a shadow mask. The surface chemical states and plasmonic properties of the Cu NDA and Cu film prepared for comparison were investigated via X-ray photoelectron spectroscopy (XPS) and ultraviolet‒visible spectroscopy. The XPS-depth profile indicated that the native oxide layer on the 50-nm-thick deposited Cu film was approximately 4.3 nm thick. For the Cu film, an absorption dip was observed at 573 nm, with two shoulder peaks attributed to the surface-oxide layer. The LSPR of the Cu NDA with a dot diameter of 60(± 5) nm was clearly observed at 652 nm despite the presence of a native oxide layer.

求助全文
约1分钟内获得全文 求助全文
来源期刊
Journal of the Korean Physical Society
Journal of the Korean Physical Society PHYSICS, MULTIDISCIPLINARY-
CiteScore
1.20
自引率
16.70%
发文量
276
审稿时长
5.5 months
期刊介绍: The Journal of the Korean Physical Society (JKPS) covers all fields of physics spanning from statistical physics and condensed matter physics to particle physics. The manuscript to be published in JKPS is required to hold the originality, significance, and recent completeness. The journal is composed of Full paper, Letters, and Brief sections. In addition, featured articles with outstanding results are selected by the Editorial board and introduced in the online version. For emphasis on aspect of international journal, several world-distinguished researchers join the Editorial board. High quality of papers may be express-published when it is recommended or requested.
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术官方微信