Characterization of Multiple Commercial Sintered-silver Pastes as Die Attachment for Power Electronics Packaging: Materials, Processing, and Properties

IF 4.6 2区工程技术 Q1 ENGINEERING, ELECTRICAL & ELECTRONIC

IEEE Journal of Emerging and Selected Topics in Power Electronics Pub Date : 2024-11-11 DOI:10.1109/jestpe.2024.3495815

Meiyu Wang, Haobo Zhang, Xiaona Du, Haidong Yan, Weibo Hu, Yunhui Mei

引用次数: 0

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作为电力电子封装芯片附件的多种商用烧结银浆的特性分析：材料、加工和特性

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来源期刊

IEEE Journal of Emerging and Selected Topics in Power Electronics ENGINEERING, ELECTRICAL & ELECTRONIC-

CiteScore

12.50

自引率

9.10%

发文量

547

审稿时长

3 months

期刊介绍： The aim of the journal is to enable the power electronics community to address the emerging and selected topics in power electronics in an agile fashion. It is a forum where multidisciplinary and discriminating technologies and applications are discussed by and for both practitioners and researchers on timely topics in power electronics from components to systems.