From the Editor

IF 2.6 4区工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC

IEEE Electrical Insulation Magazine Pub Date : 2024-10-17 DOI:10.1109/MEI.2024.10721382

引用次数: 0

Abstract

It is hard to believe that the end of the year is nearly upon us. This year has been filled with several great DEIS events and conferences, including EIC, ICD, and CEIDP. Each event has allowed members to meet in person and, in some cases, to see their long-time friends. In other cases, members had an opportunity to meet new colleagues and bright young minds that will hopefully become new friends. These events are always a sharing of knowledge and experience coupled with social networking.

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编辑的话

很难相信，年底就要到了。今年，DEIS 举办了多场精彩的活动和会议，包括 EIC、ICD 和 CEIDP。每次活动都让会员们有机会亲自见面，在某些情况下，还能见到他们的老朋友。在其他情况下，成员们有机会结识新同事和聪明的年轻人，希望他们能成为新朋友。这些活动总是在分享知识和经验的同时建立社交网络。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

IEEE Electrical Insulation Magazine 工程技术-工程：电子与电气

CiteScore

4.60

自引率

3.40%

发文量

121

审稿时长

>12 weeks

期刊介绍： The EI Magazine publishes articles written by authors from industry, research institutes and academia. The articles are more practical in content than the papers published in the Transactions. Usually three articles are published in each issue. The articles deal with dielectric materials, processes and new developments applied to industry products. Also the EI Magazine is used to promote upcoming conferences and solicits papers for the conferences. In addition, reports on past conferences are given in many issues. Book reviews and news items are included. An editorial is written by both the EIC and the President of DEIS in alternate issues. Advertising of insulation products appears in many issues.