Pan Huang, Jiming Chen, Yiming Wang, Yanyu Chen, Zhengxing Wei, Shiyu Cui, Yi Zhou, Qian Li, Pinghuai Wang
{"title":"Effect of HIP bonding temperature and duration on the interfacial microstructure and mechanical properties of W/steel joint with an Fe interlayer","authors":"Pan Huang, Jiming Chen, Yiming Wang, Yanyu Chen, Zhengxing Wei, Shiyu Cui, Yi Zhou, Qian Li, Pinghuai Wang","doi":"10.1016/j.fusengdes.2024.114685","DOIUrl":null,"url":null,"abstract":"<div><div>HIP experiments were conducted at temperatures of 950, 900, and 850 °C for durations of 60, 135, and 240 min respectively in this study, the effect of bonding temperature and duration on the interfacial microstructure and mechanical properties of the joint was investigated. The results demonstrate that reducing the HIP temperature from 980 to 850 °C leads to a significant decrease in the thickness of the W/Fe reaction layer. This reduction enables bonding interfaces without reaction layer at temperatures of 900 and 850 °C. However, as the temperature decreases, there is an initial increase followed by a subsequent decrease in shear strength with a maximum shear strength achieved at 950 °C reaching up to 322 MPa. Prolonging the bonding duration at a temperature of 950 °C results in a rapid transition of W/Fe reaction layer from Fe<sub>2</sub>W to Fe<sub>3</sub>W<sub>3</sub>C which weakens the overall bonding performance. Conversely, increasing the bonding duration at temperatures of 900 and 850 °C has minimal impact on both interfacial microstructure and bonding strength.</div></div>","PeriodicalId":55133,"journal":{"name":"Fusion Engineering and Design","volume":null,"pages":null},"PeriodicalIF":1.9000,"publicationDate":"2024-10-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Fusion Engineering and Design","FirstCategoryId":"5","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S0920379624005350","RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"NUCLEAR SCIENCE & TECHNOLOGY","Score":null,"Total":0}
引用次数: 0
Abstract
HIP experiments were conducted at temperatures of 950, 900, and 850 °C for durations of 60, 135, and 240 min respectively in this study, the effect of bonding temperature and duration on the interfacial microstructure and mechanical properties of the joint was investigated. The results demonstrate that reducing the HIP temperature from 980 to 850 °C leads to a significant decrease in the thickness of the W/Fe reaction layer. This reduction enables bonding interfaces without reaction layer at temperatures of 900 and 850 °C. However, as the temperature decreases, there is an initial increase followed by a subsequent decrease in shear strength with a maximum shear strength achieved at 950 °C reaching up to 322 MPa. Prolonging the bonding duration at a temperature of 950 °C results in a rapid transition of W/Fe reaction layer from Fe2W to Fe3W3C which weakens the overall bonding performance. Conversely, increasing the bonding duration at temperatures of 900 and 850 °C has minimal impact on both interfacial microstructure and bonding strength.
期刊介绍:
The journal accepts papers about experiments (both plasma and technology), theory, models, methods, and designs in areas relating to technology, engineering, and applied science aspects of magnetic and inertial fusion energy. Specific areas of interest include: MFE and IFE design studies for experiments and reactors; fusion nuclear technologies and materials, including blankets and shields; analysis of reactor plasmas; plasma heating, fuelling, and vacuum systems; drivers, targets, and special technologies for IFE, controls and diagnostics; fuel cycle analysis and tritium reprocessing and handling; operations and remote maintenance of reactors; safety, decommissioning, and waste management; economic and environmental analysis of components and systems.