Compact Inversely-Designed Vertical Coupler with Bottom Reflector for Sub-Decibel Fiber-to-Chip Coupling on Silicon-on-Insulator Platform

Shiang-Yu Huang, Stefanie Barz
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Abstract

Inverse design via topology optimization has led to innovations in integrated photonics and offers a promising way for designing high-efficiency on-chip couplers with a minimal footprint. In this work, we exploit topology optimization to design a compact vertical coupler incorporating a bottom reflector, which achieves sub-decibel coupling efficiency on the 220-nm silicon-on-insulator platform. The final design of the vertical coupler yields a predicted coupling efficiency of -0.35 dB at the wavelength of 1550 nm with a footprint of 14 {\mu}m x 14 {\mu}m, which is considerably smaller than conventional grating couplers. Its topology-optimized geometry can be realized by applying one full etch and one 70-nm shallow-etch process and the fabricability is also guaranteed by a minimum feature size around 150 nm. The proposed vertical coupler can further miniaturize photonic integrated circuits and enable highly-efficient networks between optical fibers and other photonic devices.
带底部反射器的紧凑型反向设计垂直耦合器,用于在硅绝缘体平台上实现亚分贝光纤到芯片耦合
通过拓扑优化进行的反向设计带来了集成光子学的创新,并为设计占用空间最小的高效片上耦合器提供了一种前景广阔的方法。在这项工作中,我们利用拓扑优化技术设计了一种包含底部反射器的紧凑型垂直耦合器,该耦合器在 220-nms 硅绝缘体平台上实现了亚分贝耦合效率。垂直耦合器的最终设计在波长为 1550 nm 时的预测耦合效率为 -0.35 dB,外形尺寸为 14 {mu}m x 14 {mu}m,比传统的光栅耦合器小得多。其拓扑优化的几何形状可以通过应用一个全蚀刻和一个 70 纳米浅蚀刻工艺来实现,而 150 纳米左右的最小特征尺寸也保证了其可制造性。这种垂直耦合器可进一步实现光子集成电路的微型化,并在光纤和其他光子设备之间形成高效网络。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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