{"title":"The well-balanced strength and conductivity in additively manufactured CuCrZr-Y2O3 composites by regulating multi-scale heterostructures","authors":"","doi":"10.1016/j.jmapro.2024.09.027","DOIUrl":null,"url":null,"abstract":"<div><p>As the key properties of copper alloys, achieving high strength and high conductivity are contradictory. Therefore, balancing strength and electrical conductivity is essential in optimizing the properties of copper alloys. This paper presents a detailed investigation into the evolution of multi-scale heterostructures and the properties of CuCrZr-Y<sub>2</sub>O<sub>3</sub> composites prepared by additive manufacturing during the annealing process. The multi-scale heterostructures, including grain size and cellular dislocation substructure, demonstrated no significant changes during the annealing process, which occurred from low to high temperatures. Following low-temperature aging treatment of the CuCrZr-Y<sub>2</sub>O<sub>3</sub> composites, the formation of fine particles, including the Cr phase, Cu<sub>4</sub>Zr phase and YCrO<sub>3</sub> phase particles, was observed. In comparison to the as-built and high-temperature annealed samples, the low-temperature aged samples exhibited the optimal combination of hardness (204 ± 10 HV), electrical conductivity (83.5 ± 0.7 %IACS) and strength (589 ± 10 MPa). The precipitation of solid solution atoms and the formation of the fine particles enhance the Orowan strengthening mechanism and improve the conductivity. This study precisely modifies the multi-scale heterostructures of the CuCrZr-Y<sub>2</sub>O<sub>3</sub> composites, offering novel insights into the electrical conductivity behavior and strengthening mechanisms.</p></div>","PeriodicalId":16148,"journal":{"name":"Journal of Manufacturing Processes","volume":null,"pages":null},"PeriodicalIF":6.1000,"publicationDate":"2024-09-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Manufacturing Processes","FirstCategoryId":"5","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S1526612524009459","RegionNum":1,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"ENGINEERING, MANUFACTURING","Score":null,"Total":0}
引用次数: 0
Abstract
As the key properties of copper alloys, achieving high strength and high conductivity are contradictory. Therefore, balancing strength and electrical conductivity is essential in optimizing the properties of copper alloys. This paper presents a detailed investigation into the evolution of multi-scale heterostructures and the properties of CuCrZr-Y2O3 composites prepared by additive manufacturing during the annealing process. The multi-scale heterostructures, including grain size and cellular dislocation substructure, demonstrated no significant changes during the annealing process, which occurred from low to high temperatures. Following low-temperature aging treatment of the CuCrZr-Y2O3 composites, the formation of fine particles, including the Cr phase, Cu4Zr phase and YCrO3 phase particles, was observed. In comparison to the as-built and high-temperature annealed samples, the low-temperature aged samples exhibited the optimal combination of hardness (204 ± 10 HV), electrical conductivity (83.5 ± 0.7 %IACS) and strength (589 ± 10 MPa). The precipitation of solid solution atoms and the formation of the fine particles enhance the Orowan strengthening mechanism and improve the conductivity. This study precisely modifies the multi-scale heterostructures of the CuCrZr-Y2O3 composites, offering novel insights into the electrical conductivity behavior and strengthening mechanisms.
期刊介绍:
The aim of the Journal of Manufacturing Processes (JMP) is to exchange current and future directions of manufacturing processes research, development and implementation, and to publish archival scholarly literature with a view to advancing state-of-the-art manufacturing processes and encouraging innovation for developing new and efficient processes. The journal will also publish from other research communities for rapid communication of innovative new concepts. Special-topic issues on emerging technologies and invited papers will also be published.