Achieving high thermal conductivity joining of Cf/C and Haynes 230 by using Cu-Mo30Cu-Ti composite foil as thermal interface material

Abstract

Haynes 230 is widely used in high-temperature regions in the aerospace field. However, the long-term exposure to high-temperature environments results in catastrophic structural failures. Therefore, how to make the heat evacuate quickly and efficiently has become an urgent problem to be solved. Here, we have investigated for the first time the use of Cu-Mo30Cu-Ti composite foil as a thermal interface material to join the C_f/C composite and Haynes 230 in the form of brazing to attain stable operation of the component. The results show that the Cu-Mo30Cu-Ti composite foils form a metallurgical joining with the matrix materials and construct a heat transfer channel between them. When the brazing parameter reaches 1220 °C for 10 min, the thermal conductivity (29.9–34.8 W·m⁻¹·K⁻¹, testing in the range of 600–900 °C) of the joint is improved by 500 % ~ 600 % compared with that before brazing (4.5–5.5 W·m⁻¹·K⁻¹). Our work provides some references to promote the application of C_f/C composite and Haynes 230 in future high-temperature thermal management.