Influence of particle size distribution on hydroxyapatite slurry and scaffold properties fabricated using digital light processing

IF 6.1 1区 工程技术 Q1 ENGINEERING, MANUFACTURING
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引用次数: 0

Abstract

In order to clarify the mechanism of particle size distribution in DLP printing process of HA ceramics, five groups of HA slurries with different particle size distributions were prepared, and the effect of particle size distribution on the performance of HA slurry and printed HA samples was systematically studied. The results demonstrated that increasing the content of nano HA powder enhances the stability of the HA slurry. However, this also led to an increase in excess curing width due to intensified scattering during the curing process. In terms of the performance of the sintered samples, due to the higher sintering activity of nano powder, the increase of nano HA content from 0 % to 40 % promoted the linear shrinkage of the sample size in the x, y, and z directions, and increased the density of the sintered parts by 13.25 %, the compressive strength by 21.36 %, and the flexural strength by 81.14 %.

粒度分布对使用数字光处理技术制造的羟基磷灰石浆料和支架性能的影响
为了阐明粒度分布在HA陶瓷DLP印刷过程中的作用机理,制备了五组不同粒度分布的HA浆料,并系统研究了粒度分布对HA浆料和印刷HA样品性能的影响。结果表明,增加纳米 HA 粉末的含量可提高 HA 泥浆的稳定性。然而,由于固化过程中散射加剧,这也导致了固化宽度的增加。在烧结样品的性能方面,由于纳米粉末具有更高的烧结活性,纳米 HA 含量从 0% 增加到 40%,促进了样品尺寸在 x、y 和 z 方向上的线性收缩,并使烧结部件的密度增加了 13.25%,抗压强度增加了 21.36%,抗折强度增加了 81.14%。
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来源期刊
Journal of Manufacturing Processes
Journal of Manufacturing Processes ENGINEERING, MANUFACTURING-
CiteScore
10.20
自引率
11.30%
发文量
833
审稿时长
50 days
期刊介绍: The aim of the Journal of Manufacturing Processes (JMP) is to exchange current and future directions of manufacturing processes research, development and implementation, and to publish archival scholarly literature with a view to advancing state-of-the-art manufacturing processes and encouraging innovation for developing new and efficient processes. The journal will also publish from other research communities for rapid communication of innovative new concepts. Special-topic issues on emerging technologies and invited papers will also be published.
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