Sabitha Ann Jose, Yahya Atwa, Faisal Iqbal, David McNeill and Hamza Shakeel
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引用次数: 0
Abstract
Ultra-low expansion (ULE) glasses, with their excellent material properties like low thermal expansion coefficient (0.5 ppm K−1), are highly suitable for manufacturing micromechanical resonators. However, the lack of suitable microfabrication processes primarily limits the use of ULE glasses to macroscopic applications. This paper describes a detailed micro fabrication technique for producing double paddle oscillators (DPOs) using ULE glass substrates. We used a combination of low-pressure chemical vapor deposition (LPCVD), lithography, and wet etching techniques to manufacture millimeter sized mechanical oscillator with a thickness of 500 μm. We utilized a thick layer of LPCVD polysilicon (∼2.5 μm) as a hard mask for double side etching of thick ULE substrate. We were able to successfully identify different resonant modes of the DPOs using both electrostatic and optical detection methods. A laser Doppler vibrometer system was utilized to confirm different simulated resonant modes. Additionally, quality factor was extracted for different modes from ring down measurements for the first time in ULE based DPO.
期刊介绍:
Journal of Micromechanics and Microengineering (JMM) primarily covers experimental work, however relevant modelling papers are considered where supported by experimental data.
The journal is focussed on all aspects of:
-nano- and micro- mechanical systems
-nano- and micro- electomechanical systems
-nano- and micro- electrical and mechatronic systems
-nano- and micro- engineering
-nano- and micro- scale science
Please note that we do not publish materials papers with no obvious application or link to nano- or micro-engineering.
Below are some examples of the topics that are included within the scope of the journal:
-MEMS and NEMS:
Including sensors, optical MEMS/NEMS, RF MEMS/NEMS, etc.
-Fabrication techniques and manufacturing:
Including micromachining, etching, lithography, deposition, patterning, self-assembly, 3d printing, inkjet printing.
-Packaging and Integration technologies.
-Materials, testing, and reliability.
-Micro- and nano-fluidics:
Including optofluidics, acoustofluidics, droplets, microreactors, organ-on-a-chip.
-Lab-on-a-chip and micro- and nano-total analysis systems.
-Biomedical systems and devices:
Including bio MEMS, biosensors, assays, organ-on-a-chip, drug delivery, cells, biointerfaces.
-Energy and power:
Including power MEMS/NEMS, energy harvesters, actuators, microbatteries.
-Electronics:
Including flexible electronics, wearable electronics, interface electronics.
-Optical systems.
-Robotics.