Development of a processing route for the fabrication of thin hierarchically porous copper self-standing structure using direct ink writing and sintering for electrochemical energy storage application
IF 2.7 4区 材料科学Q3 MATERIALS SCIENCE, MULTIDISCIPLINARY
{"title":"Development of a processing route for the fabrication of thin hierarchically porous copper self-standing structure using direct ink writing and sintering for electrochemical energy storage application","authors":"Vivek Mani Tripathi, Pawan Sharma, Rajnesh Tyagi","doi":"10.1557/s43578-024-01436-z","DOIUrl":null,"url":null,"abstract":"<p>The present study aims to develop a systematic processing route using direct ink writing (DIW) and pressureless sintering for fabricating hierarchically porous <span>\\(\\text{ Cu }\\)</span> (HP-<span>\\(\\text{ Cu }\\)</span>) electrodes. A 3D printable high particle loading <span>\\(\\text{ Cu }\\)</span> ink <span>\\(> 95 {\\text{wt}}\\%\\)</span> with polylactic acid as a binder was prepared. Green <span>\\({\\text{Cu}}\\)</span> samples using optimum value of <span>\\(\\text{ Cu }\\)</span> loading, nozzle diameter, layer height, and printing speed as 97 <span>\\({\\text{wt}}\\%\\)</span>, 0.2 <span>\\(\\text{mm}\\)</span>, 70% and 10 <span>\\(\\text{mm}/\\text{s}\\)</span> respectively were fabricated and subsequently sintered. A proper inter-particle bonding with 91% relative density and 215 <span>\\(\\text{Mpa}\\)</span> ultimate compressive strength was achieved. Finally, a proof-of-concept study targeting the fabrication of thin HP-<span>\\(\\text{ Cu }\\)</span> current collector was performed and the pore size of 154 ± 10 µm with a thickness of 200 µm was achieved successfully. Moreover, the prepared sample exhibited the highest coulombic efficiency of 95.86% for more than 400 h at 1 <span>\\({\\text{mAcm}}^{-2}\\)</span> making it a potential candidate for energy storage applications.</p><h3 data-test=\"abstract-sub-heading\">Graphical abstract</h3>\n","PeriodicalId":16306,"journal":{"name":"Journal of Materials Research","volume":"4 1","pages":""},"PeriodicalIF":2.7000,"publicationDate":"2024-09-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Materials Research","FirstCategoryId":"88","ListUrlMain":"https://doi.org/10.1557/s43578-024-01436-z","RegionNum":4,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"MATERIALS SCIENCE, MULTIDISCIPLINARY","Score":null,"Total":0}
引用次数: 0
Abstract
The present study aims to develop a systematic processing route using direct ink writing (DIW) and pressureless sintering for fabricating hierarchically porous \(\text{ Cu }\) (HP-\(\text{ Cu }\)) electrodes. A 3D printable high particle loading \(\text{ Cu }\) ink \(> 95 {\text{wt}}\%\) with polylactic acid as a binder was prepared. Green \({\text{Cu}}\) samples using optimum value of \(\text{ Cu }\) loading, nozzle diameter, layer height, and printing speed as 97 \({\text{wt}}\%\), 0.2 \(\text{mm}\), 70% and 10 \(\text{mm}/\text{s}\) respectively were fabricated and subsequently sintered. A proper inter-particle bonding with 91% relative density and 215 \(\text{Mpa}\) ultimate compressive strength was achieved. Finally, a proof-of-concept study targeting the fabrication of thin HP-\(\text{ Cu }\) current collector was performed and the pore size of 154 ± 10 µm with a thickness of 200 µm was achieved successfully. Moreover, the prepared sample exhibited the highest coulombic efficiency of 95.86% for more than 400 h at 1 \({\text{mAcm}}^{-2}\) making it a potential candidate for energy storage applications.
期刊介绍:
Journal of Materials Research (JMR) publishes the latest advances about the creation of new materials and materials with novel functionalities, fundamental understanding of processes that control the response of materials, and development of materials with significant performance improvements relative to state of the art materials. JMR welcomes papers that highlight novel processing techniques, the application and development of new analytical tools, and interpretation of fundamental materials science to achieve enhanced materials properties and uses. Materials research papers in the following topical areas are welcome.
• Novel materials discovery
• Electronic, photonic and magnetic materials
• Energy Conversion and storage materials
• New thermal and structural materials
• Soft materials
• Biomaterials and related topics
• Nanoscale science and technology
• Advances in materials characterization methods and techniques
• Computational materials science, modeling and theory