Development of a processing route for the fabrication of thin hierarchically porous copper self-standing structure using direct ink writing and sintering for electrochemical energy storage application

IF 2.7 4区 材料科学 Q3 MATERIALS SCIENCE, MULTIDISCIPLINARY
Vivek Mani Tripathi, Pawan Sharma, Rajnesh Tyagi
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Abstract

The present study aims to develop a systematic processing route using direct ink writing (DIW) and pressureless sintering for fabricating hierarchically porous \(\text{ Cu }\) (HP-\(\text{ Cu }\)) electrodes. A 3D printable high particle loading \(\text{ Cu }\) ink \(> 95 {\text{wt}}\%\) with polylactic acid as a binder was prepared. Green \({\text{Cu}}\) samples using optimum value of \(\text{ Cu }\) loading, nozzle diameter, layer height, and printing speed as 97 \({\text{wt}}\%\), 0.2 \(\text{mm}\), 70% and 10 \(\text{mm}/\text{s}\) respectively were fabricated and subsequently sintered. A proper inter-particle bonding with 91% relative density and 215 \(\text{Mpa}\) ultimate compressive strength was achieved. Finally, a proof-of-concept study targeting the fabrication of thin HP-\(\text{ Cu }\) current collector was performed and the pore size of 154 ± 10 µm with a thickness of 200 µm was achieved successfully. Moreover, the prepared sample exhibited the highest coulombic efficiency of 95.86% for more than 400 h at 1 \({\text{mAcm}}^{-2}\) making it a potential candidate for energy storage applications.

Graphical abstract

Abstract Image

利用直接油墨书写和烧结技术开发用于电化学储能应用的薄层多孔自立铜结构的制造工艺路线
本研究旨在开发一种使用直接墨水书写(DIW)和无压烧结制造分层多孔(HP-\(\{ Cu }\) )电极的系统加工路线。以聚乳酸为粘合剂,制备了一种可三维打印的高颗粒负载(95%)油墨。使用最佳的负载量、喷嘴直径、层高和印刷速度(分别为 97%、0.2%、70% 和 10%)制作了绿色样品,并随后进行了烧结。结果表明,颗粒间的结合良好,相对密度为 91%,极限抗压强度为 215(text{Mpa}/text{s})。最后,还进行了一项概念验证研究,目标是制备薄型 HP- (text{ Cu }\ )集流体,并成功实现了 154 ± 10 µm 的孔径和 200 µm 的厚度。此外,所制备的样品在 1 ({text{mAcm}}^{-2})条件下超过 400 小时的库仑效率达到了最高的 95.86%,使其成为储能应用的潜在候选材料。
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来源期刊
Journal of Materials Research
Journal of Materials Research 工程技术-材料科学:综合
CiteScore
4.50
自引率
3.70%
发文量
362
审稿时长
2.8 months
期刊介绍: Journal of Materials Research (JMR) publishes the latest advances about the creation of new materials and materials with novel functionalities, fundamental understanding of processes that control the response of materials, and development of materials with significant performance improvements relative to state of the art materials. JMR welcomes papers that highlight novel processing techniques, the application and development of new analytical tools, and interpretation of fundamental materials science to achieve enhanced materials properties and uses. Materials research papers in the following topical areas are welcome. • Novel materials discovery • Electronic, photonic and magnetic materials • Energy Conversion and storage materials • New thermal and structural materials • Soft materials • Biomaterials and related topics • Nanoscale science and technology • Advances in materials characterization methods and techniques • Computational materials science, modeling and theory
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