High‐efficiency electrothermal and electromagnetic interference shielding performance of expanded graphite/silicone film

IF 4.8 2区 材料科学 Q2 MATERIALS SCIENCE, COMPOSITES
Yangle Dong, Xiaoyan Yuan
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Abstract

Expanded graphite (EG) is a desired filler for electrothermal and electromagnetic interference (EMI) shielding because of its easy access, low‐cost, lightweight, high conductivity, and heat sensitivity. Herein, fluffy EG was prepared from natural flake graphite (NFG) by a simple expansive technology and subsequently heat treatment at 800°C for 2.0 h in 5% Ar/H2 atmosphere. EG/silicone films with a filling ratio of 15 wt% were obtained via hot‐pressing, which exhibited sensitive electrothermal and excellent EMI shielding performances. When the applied voltages were 5.0, 10.0, and 15.0 V, the steady‐state temperatures were 54.0, 136.5, and 237.8°C in the 30s, respectively. Meanwhile, their average EMI shielding efficiency was greater than 20 dB in 2–18 GHz at 0.84 mm, which was 6.3 times as much as NFG/silicone film. Therefore, this study offers a simple and effective strategy for preparing excellent electrothermal‐EMI shielding materials.Highlights Fluffy EG is prepared by a simple expansive method and treatment at 800°C. EG/silicone films exhibit good electrothermal and EMI shielding performances. Steady temperatures of 55.0/136.5/237.8°C are gotten at 5/10/15 V in 30 s. The EMI shielding efficiency is greater than 20 dB at 0.84 mm. Good properties are due to the EG with high conductivity and fluffy structure.

Abstract Image

膨胀石墨/硅薄膜的高效电热和电磁干扰屏蔽性能
膨胀石墨(EG)因其易获得、成本低、重量轻、导电率高和热敏性强等特点,成为电热和电磁干扰(EMI)屏蔽的理想填料。本文采用简单的膨胀技术从天然鳞片石墨(NFG)中制备出蓬松的 EG,然后在 5% Ar/H2 气氛中于 800°C 下热处理 2.0 小时。通过热压获得了填充率为 15 wt% 的 EG/硅薄膜,该薄膜具有灵敏的电热性能和优异的 EMI 屏蔽性能。当施加电压为 5.0、10.0 和 15.0 V 时,30 秒内的稳态温度分别为 54.0、136.5 和 237.8°C。同时,在 0.84 mm 时,它们在 2-18 GHz 的平均 EMI 屏蔽效率大于 20 dB,是 NFG/硅薄膜的 6.3 倍。因此,这项研究为制备优异的电热-EMI 屏蔽材料提供了一种简单有效的策略。亮点蓬松的 EG 是通过简单的膨胀法和 800°C 处理制备的。EG 硅薄膜具有良好的电热和 EMI 屏蔽性能。在 5/10/15 V 电压下,30 秒内可获得 55.0/136.5/237.8°C 的稳定温度。良好的性能得益于具有高导电率和蓬松结构的 EG。
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来源期刊
Polymer Composites
Polymer Composites 工程技术-材料科学:复合
CiteScore
7.50
自引率
32.70%
发文量
673
审稿时长
3.1 months
期刊介绍: Polymer Composites is the engineering and scientific journal serving the fields of reinforced plastics and polymer composites including research, production, processing, and applications. PC brings you the details of developments in this rapidly expanding area of technology long before they are commercial realities.
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