Robust Dual Equivariant Gradient Antibacterial Wound Dressing-Loaded Artificial Skin with Nano-chitin Particles Via an Electrospinning-Reactive Strategy

IF 17.2 1区工程技术 Q1 MATERIALS SCIENCE, MULTIDISCIPLINARY

Advanced Fiber Materials Pub Date : 2024-09-09 DOI:10.1007/s42765-024-00476-8

Lin Wang, Tengxiao Huang, Xiaowei Xu, Nitong Bu, Zhenzhen Wu, Yunpeng Zhao, Ya-Qin Zhou, Su Chen, Yong Chen, Jie Pang

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Abstract

Excess biological fluids around skin wounds can lead to infections and impede the healing process. Researchers have extensively studied dressings with varying water contents for wound care. However, hydrophilic and hydrophobic-hydrophilic dressings often face challenges such as slow fluid transfer and excessive retention. This study introduces an innovative approach involving the use of superhydrophobic–hydrophobic–hydrophilic dual-gradient electrospun nanofibers to form a 3D biomimetic nanofiber scaffold (3D BNSF). The 3D BNSF is composed of hydrophobic polycaprolactone and thermoplastic polyurethane, along with antibacterial, superhydrophobic nano-chitin particles. In vitro and in vivo experiments have demonstrated that this scaffold exhibits excellent antibacterial properties and compatibility with cells, facilitating complete wound healing and regeneration. This study offers a new perspective on the targeted acceleration of wound healing, with the potential to become an alternative strategy for clinical applications.

Graphical Abstract

Abstract Image

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通过电纺丝-反应策略在伤口敷料中添加纳米甲壳素颗粒的强效双等分梯度抗菌人工皮肤

皮肤伤口周围过多的生物液体会导致感染，阻碍伤口愈合。研究人员对不同含水量的伤口护理敷料进行了广泛研究。然而，亲水性和疏水性-亲水性敷料经常面临液体传输缓慢和过度滞留等挑战。本研究介绍了一种创新方法，即使用超疏水-疏水-亲水双梯度电纺纳米纤维形成三维仿生物纳米纤维支架（3D BNSF）。三维 BNSF 由疏水性聚己内酯和热塑性聚氨酯以及抗菌超疏水性纳米壳质颗粒组成。体外和体内实验证明，这种支架具有优异的抗菌性能和与细胞的相容性，可促进伤口的完全愈合和再生。这项研究为有针对性地加速伤口愈合提供了一个新的视角，有望成为临床应用的另一种策略。

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来源期刊

Advanced Fiber Materials Multiple-

CiteScore

18.70

自引率

11.20%

发文量

109

期刊介绍： Advanced Fiber Materials is a hybrid, peer-reviewed, international and interdisciplinary research journal which aims to publish the most important papers in fibers and fiber-related devices as well as their applications.Indexed by SCIE, EI, Scopus et al. Publishing on fiber or fiber-related materials, technology, engineering and application.