On process stability and sustainability of controlled-Electro Chemical Discharge Machining (ECDM)

IF 4.1 2区材料科学 Q2 ENGINEERING, MANUFACTURING

Materials and Manufacturing Processes Pub Date : 2024-08-13 DOI:10.1080/10426914.2024.2390388

Dil Bahar, Akshay Dvivedi, Pradeep Kumar

引用次数: 0

Abstract

To mitigate the transmission losses, glass vias have the potential to replace silicon vias in wireless transmission systems. In the wake of limitations of the existing methods, ECDM is an evolving ...

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受控化学放电加工（ECDM）的工艺稳定性和可持续性

为了减少传输损耗，玻璃通孔有可能取代无线传输系统中的硅通孔。鉴于现有方法的局限性，ECDM 是一种不断发展的方法。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

Materials and Manufacturing Processes 工程技术-材料科学：综合

CiteScore

9.00

自引率

22.90%

发文量

132

审稿时长

3.4 months

期刊介绍： Materials and Manufacturing Processes deals with issues that result in better utilization of raw materials and energy, integration of design and manufacturing activities requiring the invention of suitable new manufacturing processes and techniques, unmanned production dependent on efficient and reliable control of various processes including intelligent processing, introduction of new materials in industrial production necessitating new manufacturing process technology, and more. Information is offered in various formats, including research articles, letter reports, review articles, conference papers, applied research, book and conference reviews, and entire issues devoted to symposia. All submitted manuscripts are subject to initial appraisal by the Editors, and, if found suitable for further consideration, to peer review by independent, anonymous expert referees. All peer review is single blind and submission is online via ScholarOne Manuscripts.