A heterogenous integrated neural recording system with elastocapillary self-assembled Au-PDMS-PEG neural probe and customized ASIC

IF 2.4 4区工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC

Journal of Micromechanics and Microengineering Pub Date : 2024-09-03 DOI:10.1088/1361-6439/ad6f1c

Gang Wang, Changhua You, Liu Yang, Daoyin Liu, Huanhuan Zeng, Ning Xue, Lei Yao

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Abstract

This study presents the design and implementation of a heterogenous integrated neural recording system consisting of a flexible Au-PDMS-PEG probe and customized complementary metal oxide semiconductor (CMOS) application-specific integrated circuit (ASIC) in a standard 0.18 μm process. The flexible Au-PDMS-PEG probe was prepared by an elastocapillary self-assembled process, achieving an electrode impedance of 250 kΩ (@1 kHz). The customized CMOS ASIC contains 36 modular digital pixels (MDP). It achieves 5.69 μV_rms input referred noise, 10.29 effective number of bits, 49.5 μW power consumption, and 0.092 mm² area for a single MDP unit. Spontaneous spikes were also recorded in the mouse cortex, with a peak-to-peak amplitude of 389.2 μV_PP and a signal-to-noise ratio of 19.36. Benchtop and in-vivo experiments were conducted to validate the functionality and performance of the proposed neural recording system.

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带有弹性毛细管自组装金-PDMS-PEG 神经探针和定制 ASIC 的异质集成神经记录系统

本研究介绍了一种异源集成神经记录系统的设计与实现，该系统由柔性金-PDMS-PEG探针和定制的互补金属氧化物半导体（CMOS）专用集成电路（ASIC）组成，采用标准的 0.18 μm 工艺。柔性金-PDMS-PEG 探针是通过弹性毛细管自组装工艺制备的，电极阻抗为 250 kΩ (@1 kHz)。定制的 CMOS ASIC 包含 36 个模块化数字像素（MDP）。单个 MDP 单元的输入参考噪声为 5.69 μVrms，有效位数为 10.29 位，功耗为 49.5 μW，面积为 0.092 平方毫米。在小鼠皮层中也记录到了自发尖峰，峰峰振幅为 389.2 μVPP，信噪比为 19.36。为了验证所提议的神经记录系统的功能和性能，我们进行了台式和体内实验。

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来源期刊

Journal of Micromechanics and Microengineering 工程技术-材料科学：综合

CiteScore

4.50

自引率

4.30%

发文量

136

审稿时长

2.8 months

期刊介绍： Journal of Micromechanics and Microengineering (JMM) primarily covers experimental work, however relevant modelling papers are considered where supported by experimental data. The journal is focussed on all aspects of: -nano- and micro- mechanical systems -nano- and micro- electomechanical systems -nano- and micro- electrical and mechatronic systems -nano- and micro- engineering -nano- and micro- scale science Please note that we do not publish materials papers with no obvious application or link to nano- or micro-engineering. Below are some examples of the topics that are included within the scope of the journal: -MEMS and NEMS: Including sensors, optical MEMS/NEMS, RF MEMS/NEMS, etc. -Fabrication techniques and manufacturing: Including micromachining, etching, lithography, deposition, patterning, self-assembly, 3d printing, inkjet printing. -Packaging and Integration technologies. -Materials, testing, and reliability. -Micro- and nano-fluidics: Including optofluidics, acoustofluidics, droplets, microreactors, organ-on-a-chip. -Lab-on-a-chip and micro- and nano-total analysis systems. -Biomedical systems and devices: Including bio MEMS, biosensors, assays, organ-on-a-chip, drug delivery, cells, biointerfaces. -Energy and power: Including power MEMS/NEMS, energy harvesters, actuators, microbatteries. -Electronics: Including flexible electronics, wearable electronics, interface electronics. -Optical systems. -Robotics.