{"title":"Heterogeneous micro-architectonic integration of SU-8 and highly entangled polyacrylamide hydrogel to realize cut-resistant soft superhydrophobic surfaces","authors":"Junce Cheng and Tingyi ‘Leo’ Liu","doi":"10.1088/1361-6439/ad76b6","DOIUrl":null,"url":null,"abstract":"This paper presents a novel idea to create cut-resistant superhydrophobic (SHPo) surfaces by integrating an array of SU-8 micropillars on a highly entangled polyacrylamide (PAAm) hydrogel substrate. We begin by demonstrating that this highly entangled PAAm hydrogel exhibits superior resistance to cutting while being as transparent, flexible, and stretchable as other polymeric substrates like polydimethylsiloxane (PDMS). Currently, there are no well-known methods or chemicals to directly integrate SU-8 and PAAm with a covalent bond. To overcome this challenge, we introduce a thin layer of chemically modified PDMS between the SU-8 and PAAm so that covalent bonds can be formed between both the SU-8/PDMS interface and the PDMS/PAAm interface. After validating the reliability of the bonding in our experiments, we develop a heterogeneous integration process to fabricate the desired SHPo surface. To demonstrate the critical role of PAAm hydrogel in achieving the cut-resistant SHPo surface, we contrast this new SHPo surface with a reference version that uses a PDMS substrate instead. We conduct microscopic inspections using scanning electron microscopy and a contact angle goniometer before and after cutting the two surfaces. These evaluations show significant differences in their structural integrity and behavior in water interaction.","PeriodicalId":16346,"journal":{"name":"Journal of Micromechanics and Microengineering","volume":null,"pages":null},"PeriodicalIF":2.4000,"publicationDate":"2024-09-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Micromechanics and Microengineering","FirstCategoryId":"5","ListUrlMain":"https://doi.org/10.1088/1361-6439/ad76b6","RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0
Abstract
This paper presents a novel idea to create cut-resistant superhydrophobic (SHPo) surfaces by integrating an array of SU-8 micropillars on a highly entangled polyacrylamide (PAAm) hydrogel substrate. We begin by demonstrating that this highly entangled PAAm hydrogel exhibits superior resistance to cutting while being as transparent, flexible, and stretchable as other polymeric substrates like polydimethylsiloxane (PDMS). Currently, there are no well-known methods or chemicals to directly integrate SU-8 and PAAm with a covalent bond. To overcome this challenge, we introduce a thin layer of chemically modified PDMS between the SU-8 and PAAm so that covalent bonds can be formed between both the SU-8/PDMS interface and the PDMS/PAAm interface. After validating the reliability of the bonding in our experiments, we develop a heterogeneous integration process to fabricate the desired SHPo surface. To demonstrate the critical role of PAAm hydrogel in achieving the cut-resistant SHPo surface, we contrast this new SHPo surface with a reference version that uses a PDMS substrate instead. We conduct microscopic inspections using scanning electron microscopy and a contact angle goniometer before and after cutting the two surfaces. These evaluations show significant differences in their structural integrity and behavior in water interaction.
期刊介绍:
Journal of Micromechanics and Microengineering (JMM) primarily covers experimental work, however relevant modelling papers are considered where supported by experimental data.
The journal is focussed on all aspects of:
-nano- and micro- mechanical systems
-nano- and micro- electomechanical systems
-nano- and micro- electrical and mechatronic systems
-nano- and micro- engineering
-nano- and micro- scale science
Please note that we do not publish materials papers with no obvious application or link to nano- or micro-engineering.
Below are some examples of the topics that are included within the scope of the journal:
-MEMS and NEMS:
Including sensors, optical MEMS/NEMS, RF MEMS/NEMS, etc.
-Fabrication techniques and manufacturing:
Including micromachining, etching, lithography, deposition, patterning, self-assembly, 3d printing, inkjet printing.
-Packaging and Integration technologies.
-Materials, testing, and reliability.
-Micro- and nano-fluidics:
Including optofluidics, acoustofluidics, droplets, microreactors, organ-on-a-chip.
-Lab-on-a-chip and micro- and nano-total analysis systems.
-Biomedical systems and devices:
Including bio MEMS, biosensors, assays, organ-on-a-chip, drug delivery, cells, biointerfaces.
-Energy and power:
Including power MEMS/NEMS, energy harvesters, actuators, microbatteries.
-Electronics:
Including flexible electronics, wearable electronics, interface electronics.
-Optical systems.
-Robotics.