Microstructure evolution and property enhancement of CuCr50 alloys through the synergistic effects by hot-forging deformation and heat treatment

Wang An, Zhihe Dou, Tingan Zhang, Jinru Han
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Abstract

In this study, CuCr50 alloys were prepared by aluminum thermal reduction-high frequency refining process, and the properties were improved through hot forging and heat treatment. With increasing deformation, large Cr particles were spheroidized and refined, significantly improving the performance of the alloy. When the deformation exceeds 27%, the conductivity reaches 17.73 MS/m, the hardness reaches 116.5 HB, and the density reaches 7.91 g/cm. After solution at 975 °C for 1h and aging at 550 °C for 4h, the conductivity of the CuCr50 alloy further increased to 19.63 MS/m, the hardness reaches 121.5 HB. Compared with the as-cast alloy, the conductivity, hardness and density are increased by 71.07%, 18.81% and 2.99%, respectively. In the 5% deformed CuCr50 alloy the precipitates of nanoscale Cr particles formed a co-lattice with the copper matrix. In the 14% deformed CuCr50 alloy, nanoscale Cr particles precipitated and dispersed in the Cu matrix, and the relationship between the precipitated Cr phase and the Cu matrix was incoherent. The amount of precipitated Cr phase in the 27% deformed CuCr50 alloy had a semi-coherent relationship with the Cu matrix, the orientations of Cu()//Cr(110). The hardness enhancement is mainly attributed to grain refinement and density increase, and the conductivity enhancement is mainly attributed to Cr particle precipitation after aging treatment.
通过热锻变形和热处理的协同效应实现 CuCr50 合金的微观结构演变和性能提升
本研究采用铝热还原-高频精炼工艺制备了 CuCr50 合金,并通过热锻和热处理改善了其性能。随着变形量的增加,大的铬颗粒被球化和细化,合金的性能得到显著改善。当变形超过 27% 时,电导率达到 17.73 MS/m,硬度达到 116.5 HB,密度达到 7.91 g/cm。在 975 °C 下固溶 1 小时并在 550 °C 下时效 4 小时后,CuCr50 合金的导电率进一步提高到 19.63 MS/m,硬度达到 121.5 HB。与铸态合金相比,导电率、硬度和密度分别提高了 71.07%、18.81% 和 2.99%。在 5%变形的 CuCr50 合金中,纳米级铬颗粒析出物与铜基体形成共格。在 14% 变形的 CuCr50 合金中,纳米级铬颗粒析出并分散在铜基体中,析出的铬相与铜基体之间的关系不连贯。而在 27% 的变形 CuCr50 合金中,析出的铬相数量与铜基体、Cu()//Cr(110) 的取向呈半相干关系。硬度的提高主要归因于晶粒细化和密度增加,而导电性的提高主要归因于时效处理后铬颗粒的析出。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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