The influence of annealing process on the sagging resistance of AA3003 foil and laminated AA4343/AA3003/AA4343 composite foil materials

Jianzhu Wang, Kunyuan Gao, Xiangyuan Xiong, Yue Zhang, Yusheng Ding, Xiaolan Wu, Shengping Wen, Hui Huang, Wu Wei, Li Rong, Zuoren Nie, Dejing Zhou
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Abstract

Upon 98% reduction cold-rolling, a single layer AA3003 foil material of 115 μm thick was intermediately annealed at 300–420 °C/1-8 h, and the preferred temperature and time of the intermediate annealing for the laminated AA4343/AA3003/AA4343 composite foil material were determined. All of these samples were cold rolled by 40% to 70 μm thick and finally annealed at a temperature in the range of 300–550 °C for 1–9 h. Their sagging resistance and microstructure were investigated using simulated brazing treatment, optical microscopy (OM), scanning electron microscopy (SEM) and transmission electron microscopy (TEM). For the single layer AA3003 foil, the sagging distance decreased first and then increased with increasing intermediate annealing temperature, and the lowest sagging distance corresponds to the coarsest grain in the recrystallized sample. After the final annealing for the single layer, the sagging distance decreased monotonously. For the laminated foil subjected to the final annealing, the sagging distance curves decreased first and then increased with increasing annealing temperature and time. The improvement of sagging resistance was attributed to the recovery of two types of materials during annealing process. The deterioration of the sagging resistance in the laminated foils was due to the corrosion in the brazing process, resulted from the Si diffusion from the cladding layer into the core layer. It is the coarse grains, few dislocations and minimal diffusion of Si that are crucial for improving the sagging resistance of the laminated foils.
退火工艺对 AA3003 箔和层压 AA4343/AA3003/AA4343 复合箔材料抗下垂性能的影响
将厚度为 115 μm 的单层 AA3003 箔材料冷轧 98%后,在 300-420 °C/1-8 小时的温度下进行中间退火,并确定了层压 AA4343/AA3003/AA4343 复合箔材料的优选中间退火温度和时间。使用模拟钎焊处理、光学显微镜(OM)、扫描电子显微镜(SEM)和透射电子显微镜(TEM)研究了这些样品的抗下垂性和微观结构。对于单层 AA3003 箔,随着中间退火温度的升高,下垂距离先减小后增大,最低的下垂距离对应于再结晶样品中最粗的晶粒。单层退火后,下垂距单调地减小。对于经过最终退火的层叠箔,随着退火温度和时间的增加,下垂距离曲线先减小后增大。抗下垂性的改善归因于退火过程中两种材料的恢复。层压箔抗下垂性能的下降是由于钎焊过程中的腐蚀,是由于硅从覆层扩散到芯层造成的。晶粒粗大、位错少和硅扩散量极小是提高层压箔抗下垂性的关键。
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