Magnetic and ultrasonic vibration dual-field assisted ultra-precision diamond cutting of high-entropy alloys

Abstract

Despite the remarkable achievements in single-energy field-assisted diamond cutting technology, its performance remains unsatisfactory for processing high-entropy alloys (HEAs), targeted for next-generation large-scale industrial applications due to their exceptional properties. The challenge lies in overcoming the limitations of current single-energy field-assisted processing to achieve ultra-precision manufacturing of these advanced materials. This study proposes a multi-energy field-assisted ultra-precision machining technology, the magnetic and ultrasonic vibration dual-field assisted diamond cutting (MUVFDC), to address the current challenges. The phenomenological aspects of the dual-field coupling effect on HEAs are explored and investigated through comprehensive characterization of the workpiece material, ranging from macroscopic surface morphology to microscopic structural features. These analyses are performed based on experimental results from four different processing technologies: non-energy field, magnetic field, ultrasonic vibration field, and dual-field assisted machining. Research results demonstrate that MUVFDC technology effectively combines the advantages of a vibration field, which enhances cutting stability, and a magnetic field, which improves the machinability of materials. Additionally, this coupling technology addresses the challenges associated with single-energy field machining: it mitigates the difficulty of controlling surface scratches caused by tiny hard particles in a vibration field and suppresses the rapid tool wear encountered in a magnetic field. Furthermore, the gradient evolution of the subsurface microstructure reveals that the vibration field suppresses the severe matrix deformation induced by magnetic excitation. Simultaneously, the magnetic field reduces the size inhomogeneity of recrystallized grains caused by intermittent cutting. Overall, MUVFDC technology enhances surface quality, suppresses tool wear, smooths chip morphology, and reduces subsurface damage compared to single-energy field or non-energy-assisted machining. This work breaks through the performance limitations of traditional single-energy field-assisted processing and advances the understanding of the dual-field coupling effects in HEAs machining. It also presents a promising processing technology for the future ultra-precision manufacturing of advanced materials.