Electrical conductivity field analysis: A prognostic instrument for real time monitoring of friction stir welding process

IF 6.1 1区 工程技术 Q1 ENGINEERING, MANUFACTURING
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Abstract

Constant monitoring of manufacturing processes is crucial for ensuring high-quality products and cost-effectiveness. Non-destructive testing (NDT) techniques, such as eddy current testing (ECT), offer a direct and accurate means of evaluating weld quality in real-time. ECT can assess microstructural changes in welded materials by measuring electrical conductivity. Establishing a robust correlation between electrical conductivity and microstructural changes induced by FSW process parameters remains a critical step to bridge existing knowledge gaps. In this study, electrical conductivity field analysis using eddy currents was conducted on AA6082-T6 FSW joints. A pivotal factor controlling process heat input and influencing defect formation and weld microstructural features is the ratios of FSW tool rotational speed (ω) to travel speed (v). Previous works often evaluated only one set of process parameters, while our study examines multiple combinations of ω and welding speed v to develop a more robust correlation between electrical conductivity and microstructural changes. Both defective and defect-free joints were obtained employing various ω/v ratio and electrical conductivity results were compared with hardness measurements and tensile test results. The analysis reveals a consistent trend between electrical conductivity variations, microstructural changes in weld zones, and microhardness as the ω/ν ratio varies. Our findings show that, at a constant travel speed, an increasing ω/ν ratio is associated with enhanced microhardness and decreased electrical conductivity, attributed to grain refinement. Conversely, at a constant rotational speed, a higher ω/ν ratio leads to increased electrical conductivity, due to the enhanced dissolution of strengthening precipitates. Furthermore, analyzing electrical conductivity profiles and identifying local maxima corresponding to weld failure zones could strengthen the correlation. This approach suggests the potential to assess variations in mechanical properties resulting from process drift, specifically influenced by changes in the ω/v parameter over time. Microstructural analysis through electrical conductivity evaluation emerges as a valuable and predictive tool for assessing weld properties, with promising applications in process monitoring.

电导率场分析:用于实时监控搅拌摩擦焊接过程的预报工具
对制造过程的持续监控对于确保高质量产品和成本效益至关重要。无损检测(NDT)技术,如涡流检测(ECT),为实时评估焊接质量提供了直接而准确的方法。ECT 可以通过测量导电性来评估焊接材料的微观结构变化。在电导率和 FSW 工艺参数引起的微观结构变化之间建立稳健的相关性仍然是弥补现有知识差距的关键步骤。本研究利用涡流对 AA6082-T6 FSW 接头进行了电导率场分析。控制工艺热输入、影响缺陷形成和焊接微观结构特征的一个关键因素是 FSW 工具旋转速度 (ω) 与移动速度 (v) 的比率。以前的研究通常只评估一组工艺参数,而我们的研究则对 ω 和焊接速度 v 的多种组合进行了研究,从而在导电率和微观结构变化之间建立了更稳健的相关性。我们采用不同的 ω/v 比率获得了有缺陷和无缺陷的接头,并将电导率结果与硬度测量结果和拉伸试验结果进行了比较。分析表明,随着 ω/ν 比值的变化,电导率变化、焊接区的微观结构变化和显微硬度之间的趋势是一致的。我们的研究结果表明,在恒定的移动速度下,ω/ν 比值的增加与显微硬度的提高和电导率的降低有关,这归因于晶粒细化。相反,在转速不变的情况下,ω/ν比值越大,导电率越高,这是由于强化沉淀的溶解作用增强了。此外,分析电导率曲线并确定与焊接失效区相对应的局部最大值可加强相关性。这种方法可以评估工艺漂移导致的机械性能变化,特别是受到 ω/v 参数随时间变化的影响。通过电导率评估进行的微观结构分析是评估焊接性能的一种有价值的预测工具,在过程监控中的应用前景广阔。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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来源期刊
Journal of Manufacturing Processes
Journal of Manufacturing Processes ENGINEERING, MANUFACTURING-
CiteScore
10.20
自引率
11.30%
发文量
833
审稿时长
50 days
期刊介绍: The aim of the Journal of Manufacturing Processes (JMP) is to exchange current and future directions of manufacturing processes research, development and implementation, and to publish archival scholarly literature with a view to advancing state-of-the-art manufacturing processes and encouraging innovation for developing new and efficient processes. The journal will also publish from other research communities for rapid communication of innovative new concepts. Special-topic issues on emerging technologies and invited papers will also be published.
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