{"title":"Novel multi-layer field shaper in electromagnetic manufacturing process technology of tube joining for uniform deformation","authors":"","doi":"10.1016/j.jmapro.2024.08.020","DOIUrl":null,"url":null,"abstract":"<div><p>Electromagnetic joining technology is widely utilized in assembling tubular components due to its ability to exert uniform magnetic pressure. To augment this pressure, a field shaper structure has been introduced. However, the conventional design may impair the uniformity of deformation, particularly at the seam. This study presents a novel multi-layer field shaper (MLFS) to enhance deformation uniformity. The performance of the MLFS was evaluated and optimized through experimental trials and simulation analysis. The results showed that MLFS achieved a 300 % increase in minimum deformation with a 56 % reduction in the aspect ratio, demonstrating that our design effectively balances efficiency with deformation uniformity. The magnetic cubic decay formula could fit the simulation data well with R<sup>2</sup> higher than 0.999. MLFS was found to enhance uniformity by creating a more even magnetic field that decreased the curvature near the plastic hinge. Compared to altering the interlayer thickness, adjusting the interlayer angle can further enhance uniformity. When the rotation angle is 60°, the radius range can be further reduced by 32.5 %, 39.0 %, and 12.2 % at energy levels of 27 kJ, 30 kJ, and 33 kJ, respectively. The above results indicate that by designing and optimizing MLFS, sufficiently large and uniform electromagnetic forces were obtained.</p></div>","PeriodicalId":16148,"journal":{"name":"Journal of Manufacturing Processes","volume":null,"pages":null},"PeriodicalIF":6.1000,"publicationDate":"2024-08-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Manufacturing Processes","FirstCategoryId":"5","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S1526612524008430","RegionNum":1,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"ENGINEERING, MANUFACTURING","Score":null,"Total":0}
引用次数: 0
Abstract
Electromagnetic joining technology is widely utilized in assembling tubular components due to its ability to exert uniform magnetic pressure. To augment this pressure, a field shaper structure has been introduced. However, the conventional design may impair the uniformity of deformation, particularly at the seam. This study presents a novel multi-layer field shaper (MLFS) to enhance deformation uniformity. The performance of the MLFS was evaluated and optimized through experimental trials and simulation analysis. The results showed that MLFS achieved a 300 % increase in minimum deformation with a 56 % reduction in the aspect ratio, demonstrating that our design effectively balances efficiency with deformation uniformity. The magnetic cubic decay formula could fit the simulation data well with R2 higher than 0.999. MLFS was found to enhance uniformity by creating a more even magnetic field that decreased the curvature near the plastic hinge. Compared to altering the interlayer thickness, adjusting the interlayer angle can further enhance uniformity. When the rotation angle is 60°, the radius range can be further reduced by 32.5 %, 39.0 %, and 12.2 % at energy levels of 27 kJ, 30 kJ, and 33 kJ, respectively. The above results indicate that by designing and optimizing MLFS, sufficiently large and uniform electromagnetic forces were obtained.
期刊介绍:
The aim of the Journal of Manufacturing Processes (JMP) is to exchange current and future directions of manufacturing processes research, development and implementation, and to publish archival scholarly literature with a view to advancing state-of-the-art manufacturing processes and encouraging innovation for developing new and efficient processes. The journal will also publish from other research communities for rapid communication of innovative new concepts. Special-topic issues on emerging technologies and invited papers will also be published.