Deep material network for thermal conductivity problems: Application to woven composites

IF 6.9 1区 工程技术 Q1 ENGINEERING, MULTIDISCIPLINARY
{"title":"Deep material network for thermal conductivity problems: Application to woven composites","authors":"","doi":"10.1016/j.cma.2024.117279","DOIUrl":null,"url":null,"abstract":"<div><p>The thermal conductivity of materials dictates their functionality and reliability, especially for materials with complex microstructural topologies, such as woven composites. In this paper, we develop a physics-informed machine-learning architecture built specifically for solving thermal conductivity problems. Originally developed for mechanical problems, we extend and develop a deep material network (DMN) that incorporates (i) principles from thermal homogenization directly into the network architecture in which nodes propagate heat flux and temperature gradient (as opposed to stress and strain in the original ‘mechanical’ DMN) and (ii) nodal rotations to capture the topological complexity of the materials’ microstructure. The result is a ‘thermal’ DMN better suited for thermal conductivity problems than the ‘mechanical’ deep material network. We demonstrate the ability of this ‘thermal’ DMN to act as an accurate reduced order model with a significantly smaller number of degrees of freedom on two different woven microstructures examples. Our results show that the ‘thermal’ DMN can not only accurately predict the averaged effective thermal conductivity of these complex weaved composite structures but also the distribution of local heat flux and temperature gradients. Based on these performances, we show how this ‘thermal’ DMN can be exercised for rapid uncertainty and sensitivity analyses to assess microstructure effects and variability of the properties of the composite’s constituents, a task that would be otherwise computationally prohibitive with direct numerical simulations. Based on its architecture, the ‘thermal’ DMN opens possibilities for multiscale, multiphysics simulations for a heterogeneous structure, especially when coupled with its mechanical counterpart.</p></div>","PeriodicalId":55222,"journal":{"name":"Computer Methods in Applied Mechanics and Engineering","volume":null,"pages":null},"PeriodicalIF":6.9000,"publicationDate":"2024-08-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://www.sciencedirect.com/science/article/pii/S0045782524005358/pdfft?md5=3786150c8d37e39cf2ec3f69877b1b82&pid=1-s2.0-S0045782524005358-main.pdf","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Computer Methods in Applied Mechanics and Engineering","FirstCategoryId":"5","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S0045782524005358","RegionNum":1,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"ENGINEERING, MULTIDISCIPLINARY","Score":null,"Total":0}
引用次数: 0

Abstract

The thermal conductivity of materials dictates their functionality and reliability, especially for materials with complex microstructural topologies, such as woven composites. In this paper, we develop a physics-informed machine-learning architecture built specifically for solving thermal conductivity problems. Originally developed for mechanical problems, we extend and develop a deep material network (DMN) that incorporates (i) principles from thermal homogenization directly into the network architecture in which nodes propagate heat flux and temperature gradient (as opposed to stress and strain in the original ‘mechanical’ DMN) and (ii) nodal rotations to capture the topological complexity of the materials’ microstructure. The result is a ‘thermal’ DMN better suited for thermal conductivity problems than the ‘mechanical’ deep material network. We demonstrate the ability of this ‘thermal’ DMN to act as an accurate reduced order model with a significantly smaller number of degrees of freedom on two different woven microstructures examples. Our results show that the ‘thermal’ DMN can not only accurately predict the averaged effective thermal conductivity of these complex weaved composite structures but also the distribution of local heat flux and temperature gradients. Based on these performances, we show how this ‘thermal’ DMN can be exercised for rapid uncertainty and sensitivity analyses to assess microstructure effects and variability of the properties of the composite’s constituents, a task that would be otherwise computationally prohibitive with direct numerical simulations. Based on its architecture, the ‘thermal’ DMN opens possibilities for multiscale, multiphysics simulations for a heterogeneous structure, especially when coupled with its mechanical counterpart.

用于热传导问题的深度材料网络:编织复合材料的应用
材料的导热性决定了其功能性和可靠性,尤其是具有复杂微结构拓扑的材料,如编织复合材料。在本文中,我们开发了一种物理信息机器学习架构,专门用于解决导热问题。该架构最初是针对机械问题开发的,我们扩展并开发了一种深度材料网络(DMN),将(i)热均质化原理直接纳入网络架构,其中节点传播热通量和温度梯度(而不是原始 "机械 "DMN 中的应力和应变);(ii)节点旋转,以捕捉材料微观结构的拓扑复杂性。因此,与 "机械 "深层材料网络相比,"热 "DMN 更适合热传导问题。我们在两个不同的编织微结构示例中演示了这种 "热 "DMN 作为精确的降阶模型的能力,其自由度数量大大减少。结果表明,"热 "DMN 不仅能准确预测这些复杂编织复合结构的平均有效热导率,还能预测局部热通量和温度梯度的分布。基于这些性能,我们展示了如何利用这种 "热 "DMN 进行快速不确定性和敏感性分析,以评估复合材料成分的微观结构效应和属性变化,否则直接进行数值模拟将导致计算量过大。基于其架构,"热 "DMN 为异质结构的多尺度、多物理场仿真提供了可能性,尤其是在与机械仿真相结合的情况下。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 求助全文
来源期刊
CiteScore
12.70
自引率
15.30%
发文量
719
审稿时长
44 days
期刊介绍: Computer Methods in Applied Mechanics and Engineering stands as a cornerstone in the realm of computational science and engineering. With a history spanning over five decades, the journal has been a key platform for disseminating papers on advanced mathematical modeling and numerical solutions. Interdisciplinary in nature, these contributions encompass mechanics, mathematics, computer science, and various scientific disciplines. The journal welcomes a broad range of computational methods addressing the simulation, analysis, and design of complex physical problems, making it a vital resource for researchers in the field.
文献相关原料
公司名称 产品信息 采购帮参考价格
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术官方微信